Apparatus for cutting substrate
An apparatus for cutting a substrate includes a laser oscillator generating a femtosecond laser beam, a first beam splitter splitting the femtosecond laser beam into first and second femtosecond laser beams, a first condenser lens receiving the first femtosecond laser beam and condensing the first femtosecond laser beam to have a first focal depth, a second condenser lens receiving the second femtosecond laser beam, and condensing the second femtosecond laser beam to have a second focal depth different from the first focal depth, and a second beam splitter receiving and splitting the first femtosecond laser beam condensed through the first condenser lens and the second femtosecond laser beam condensed through the second condenser lens, and irradiating the split first and second femtosecond laser beams at different positions on a substrate to be cut.
1. An apparatus for cutting a substrate, comprising:
a plurality of laser oscillators generating at least first and second femtosecond laser beams;
a plurality of condenser lenses receiving the at least first and second femtosecond laser beams, and condensing the received at least first and second femtosecond laser beams to have first and second focal depths being different from each other, respectively;
a reflector reflecting the first condensed femtosecond laser beam;
an optical attenuator between the reflector and the first condenser lens to adjust energy of the femtosecond laser beams; and
a beam splitter receiving and splitting the condensed at least first and second femtosecond laser beams, and irradiating the split at least first and second femtosecond laser beams at different depths in the direction vertical to the substrate to be cut,
wherein the optical attenuator includes a λ/2 plate, a linear polarizer, and a λ/4 plate are the three parts.