Trench-based power semiconductor devices with increased breakdown voltage characteristics

1. A semiconductor device comprising:

a first trench extending into a semiconductor region and having a first end and a second end;

a first dielectric layer lining opposing sidewalls of the first trench;

a first shield electrode disposed in the first trench;

a second trench extending into the semiconductor region and having a first end and a second end;

a second dielectric layer lining opposing sidewalls of the second trench;

a second shield electrode disposed in the second trench; and

a first well region of a first conductivity type disposed in the semiconductor region and between the first and second trenches, the first well region abutting at least a portion of at least one of the first and second trenches and being spaced from the first end of the first trench by at least a first distance; and

wherein there is no other well region of a first conductivity type disposed between the first well region and the first end of the first trench.

2. The semiconductor device of claim 1 , wherein the first well region is electrically coupled to a conductive layer to receive a potential.

3. The semiconductor device of claim 1 wherein the first trench extends to a first depth into the semiconductor region, and wherein the first distance is equal to the first depth.

4. The semiconductor device of claim 1 wherein the first trench extends to a first depth into the semiconductor region, wherein the first well region extends to a second depth into the semiconductor region, the second depth being less than the first depth, and wherein the first distance is equal to the difference between the first and second depths.

5. The semiconductor device of claim 1 , wherein the semiconductor region is disposed in a semiconductor die;

wherein the first ends of the first and second trenches face a first edge of the semiconductor die;

wherein a first portion of the semiconductor region is disposed between the first ends of the first and second trenches and the first edge of the semiconductor die; and

wherein the first portion does not have a perpendicular termination trench disposed in the semiconductor region.

6. The semiconductor device of claim 1 , wherein the first well region has a first end spaced from the first end of the first trench by at least the first distance, and wherein the device further comprises a field plate disposed over the first end of the first well region, the field plate being electrically coupled to the shield electrodes.

7. The semiconductor device of claim 1 , wherein the first well region has a first end spaced from the first end of the first trench by at least the first distance, and wherein there is no conductive layer disposed over the first end of the first well region that is electrically coupled to the shield electrodes.

8. A semiconductor device comprising:

a first trench extending into a semiconductor region and having a first end and a second end;

a first dielectric layer lining opposing sidewalls of the first trench;

a first shield electrode disposed in the first trench;

a second trench extending into the semiconductor region and having a first end and a second end;

a second dielectric layer lining opposing sidewalls of the second trench;

a second shield electrode disposed in the second trench; and

a first well region of a first conductivity type disposed in the semiconductor region and between the first and second trenches, the first well region being spaced from the first end of the first trench by at least a first distance; and

wherein the first trench extends to a first depth into the semiconductor region, wherein the first well region extends to a second depth into the semiconductor region, the second depth being less than the first depth, and wherein the first distance is equal to the difference between the first and second depths; and

wherein there is no other well region of a first conductivity type disposed between the first well region and the first end of the first trench.

9. The semiconductor device of claim 8 , wherein the first well region is electrically coupled to a conductive layer to receive a potential.

10. The semiconductor device of claim 8 , wherein the semiconductor region is disposed in a semiconductor die;

wherein the first ends of the first and second trenches face a first edge of the semiconductor die;

wherein a first portion of the semiconductor region is disposed between the first ends of the first and second trenches and the first edge of the semiconductor die; and

wherein the first portion does not have a perpendicular termination trench disposed in the semiconductor region.

11. The semiconductor device of claim 8 , wherein the first well region has a first end spaced from the first end of the first trench by at least the first distance, and wherein the device further comprises a field plate disposed over the first end of the first well region, the field plate being electrically coupled to the shield electrodes.

12. The semiconductor device of claim 8 , wherein the first well region has a first end spaced from the first end of the first trench by at least the first distance, and wherein there is no conductive layer disposed over the first end of the first well region that is electrically coupled to the shield electrodes.

13. A semiconductor device comprising:

a first trench extending into a semiconductor region and having a first end and a second end;

a first dielectric layer lining opposing sidewalls of the first trench;

a first shield electrode disposed in the first trench;

a second trench extending into the semiconductor region and having a first end and a second end;

a second dielectric layer lining opposing sidewalls of the second trench;

a second shield electrode disposed in the second trench; and

a first well region of a first conductivity type disposed in the semiconductor region and between the first and second trenches, the first well region being spaced from the first end of the first trench by at least a first distance; and

wherein there is no other well region of a first conductivity type disposed between the first well region and the first end of the first trench;

wherein the semiconductor region is disposed in a semiconductor die;

wherein the first ends of the first and second trenches face a first edge of the semiconductor die;

wherein a first portion of the semiconductor region is disposed between the first ends of the first and second trenches and the first edge of the semiconductor die; and

wherein the first portion does not have a perpendicular termination trench disposed in the semiconductor region.

14. The semiconductor device of claim 13 , wherein the first well region is electrically coupled to a conductive layer to receive a potential.

15. The semiconductor device of claim 13 , wherein the first well region has a first end spaced from the first end of the first trench by at least the first distance, and wherein the device further comprises a field plate disposed over the first end of the first well region, the field plate being electrically coupled to the shield electrodes.

16. The semiconductor device of claim 13 , wherein the first well region has a first end spaced from the first end of the first trench by at least the first distance, and wherein there is no conductive layer disposed over the first end of the first well region that is electrically coupled to the shield electrodes.

17. A semiconductor device comprising:

a first trench extending into a semiconductor region and having a first end and a second end;

a first dielectric layer lining opposing sidewalls of the first trench;

a first shield electrode disposed in the first trench;

a second trench extending into the semiconductor region and having a first end and a second end;

a second dielectric layer lining opposing sidewalls of the second trench;

a second shield electrode disposed in the second trench; and

a first well region of a first conductivity type disposed in the semiconductor region and between the first and second trenches, the first well region being spaced from the first end of the first trench by at least a first distance; and

wherein there is no other well region of a first conductivity type disposed between the first well region and the first end of the first trench; and

wherein the first well region has a first end spaced from the first end of the first trench by at least the first distance, and wherein the device further comprises a field plate disposed over the first end of the first well region, the field plate being electrically coupled to the shield electrodes.

18. The semiconductor device of claim 17 , wherein the first well region is electrically coupled to a conductive layer to receive a potential.

19. A semiconductor device comprising:

a first trench extending into a semiconductor region and having a first end and a second end;

a first dielectric layer lining opposing sidewalls of the first trench;

a first shield electrode disposed in the first trench;

a second trench extending into the semiconductor region and having a first end and a second end;

a second dielectric layer lining opposing sidewalls of the second trench;

a second shield electrode disposed in the second trench; and

a first well region of a first conductivity type disposed in the semiconductor region and between the first and second trenches, the first well region being spaced from the first end of the first trench by at least a first distance; and

wherein there is no other well region of a first conductivity type disposed between the first well region and the first end of the first trench; and

wherein the first well region has a first end spaced from the first end of the first trench by at least the first distance, and wherein there is no conductive layer disposed over the first end of the first well region that is electrically coupled to the shield electrodes.

20. The semiconductor device of claim 19 , wherein the first well region is electrically coupled to a conductive layer to receive a potential.