IP Library Granted Patent US 8,176,606
Granted Patent B2
US 8,176,606 · App. 12/360,424 · Granted May 15, 2012

Method of fabricating a piezoelectric vibrating piece

Assignee: Seiko Instruments Inc.
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Quick Facts
Patent No.
US 8,176,606
App. No.
12/360,424
Granted
May 15, 2012
Kind
B2
Abstract

To carry out frequency adjustment easily, accurately and efficiently and achieve low cost formation and promotion of maintenance performance without being influenced by a size of a piezoelectric vibrating piece, there is provided a method of fabricating a piezoelectric vibrating piece which is a method of fabricating a piezoelectric vibrating pieces having a piezoelectric plate 11 , a pair of exciting electrodes 12, 13 , and a pair of mount electrodes electrodes 15, 16 by utilizing a wafer S, the method including an outer shape forming step of forming a frame portion S 1 at the wafer and forming a plurality of piezoelectric plates to be connected to the frame portion by way of a connecting portion 11 a , an electrode forming step of respectively forming pairs of exciting electrodes and pairs of mount electrodes to the plurality of piezoelectric plates and forming a plurality of pairs of extended electrodes S 2 , S 3 to be respectively electrically connected to the pairs of mount electrodes by way of the connecting portion, a frequency adjusting step of adjusting a frequency of the piezoelectric plate while applying a drive voltage between the pair of the extended electrodes, and a cutting step of fragmenting the plurality of piezoelectric plates.

Claims (14)

1. A method of fabricating a plurality of piezoelectric vibrating pieces each including a piezoelectric plate, a pair of exciting electrodes formed on an outer surface of the piezoelectric plate for vibrating the piezoelectric plate when a predetermined drive voltage is applied thereto, and a pair of mount electrodes formed in a state of being aligned in parallel by constituting a predetermined interval along a width direction of the piezoelectric plate and electrically connected respectively to the pair of exciting electrodes at a time utilizing a wafer made of a piezoelectric material, the method comprising:

an outer shape forming step of forming a frame portion and forming to connect the plurality of piezoelectric plates to the frame portion in a cantilever shape by way of a connecting portion in a state of directing base end sides thereof to the frame portion by etching the wafer by a photolithography technology;

an electrode forming step of respectively forming the pairs of exciting electrodes and the pairs of mount electrodes to the plurality of piezoelectric plates and forming a plurality of pairs of extended electrodes such that each extended electrode of the pair of extended electrodes is in electrical contact with a mount electrode of a corresponding pair of the mount electrodes by way of the connecting portion on the frame portion by patterning an electrode film on the wafer, wherein each pair of the mount electrodes is formed between the corresponding pairs of exciting electrodes and extended electrodes along a direction substantially perpendicular to the width direction and is formed with a mount electrode pair length defined along the width direction, and wherein each pair of the extended electrodes is formed with an extended electrode pair length defined along the width direction that is eater than the mount electrode air length;

a frequency adjusting step of adjusting a frequency of the piezoelectric plate while vibrating the piezoelectric plate by applying the drive voltage between the pair of the extended electrodes; and

a cutting step of fragmenting the plurality of piezoelectric plates by cutting the connecting portion.

2. The method of fabricating a plurality of piezoelectric vibrating pieces according to claim 1 , wherein in the electrode forming step, the pair of extended electrodes are formed in a state of being aligned in parallel by constituting the same predetermined interval along the width direction as that of the corresponding pair of mount electrodes.

3. The method of fabricating a plurality of piezoelectric vibrating pieces according to claim 1 , wherein in the electrode forming step, a common extended electrode is formed by respectively electrically connecting a plurality of the extended electrodes on one side.

4. A method of fabricating a plurality of piezoelectric vibrating pieces each including a piezoelectric plate, a pair of exciting electrodes formed on an outer surface of the piezoelectric plate for vibrating the piezoelectric plate when a predetermined drive voltage is applied thereto, and a pair of mount electrodes formed in a state of being aligned in parallel by constituting a predetermined interval along a width direction of the piezoelectric plate and electrically connected respectively to the pair of exciting electrodes at a time utilizing a wafer made of a piezoelectric material the method comprising:

an outer shape forming step of forming a frame portion and forming to connect plurality of piezoelectric slates to the frame portion in a cantilever shape by way of a connecting portion in a state of directing base end sides thereof to the frame portion by etching the wafer by a photolithography technology;

an electrode forming step of respectively forming the pairs of exciting electrodes and the pairs of mount electrodes to the plurality of piezoelectric plates and forming a plurality of pairs of extended electrodes to be electrically connected to respectively to the pairs of mount electrodes by way of the connecting portion on the frame portion by patterning an electrode film on the wafer, wherein the electrode forming step comprises forming a common extended electrode is formed by respectively electrically connecting a plurality of the extended electrodes on one side;

a frequency adjusting step of adjusting the frequency of the piezoelectric plate is adjusted while vibrating simultaneously a plurality of the piezoelectric plates by applying the drive voltage between the common extended electrode and a plurality of the extended electrodes on other side;

a cutting step of fragmenting the plurality of piezoelectric plates by cutting the connecting portion.

5. The method of fabricating a plurality of piezoelectric vibrating pieces according to claim 4 , wherein according to the electrode forming step each pair of mount electrodes is formed between the corresponding pairs of exciting electrodes and extended electrodes along a direction substantially perpendicular to the width direction and is formed with a mount electrode pair length defined along the width direction, and wherein each pair of extended electrodes is formed with an extended electrode pair length defined along the width direction that is greater than the mount electrode pair length.

6. The method of fabricating a plurality of piezoelectric vibrating pieces according to claim 4 , wherein in the electrode forming step, the pair of extended electrodes are formed in a state of being aligned in parallel by constituting the same predetermined interval along the width direction as that of the corresponding pair of mount electrodes.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2013
From: SEIKO INSTRUMENTS INC.
To: SII CRYSTAL TECHNOLOGY INC.
Reel/Frame 031085/0852 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2009
From: KOBAYASHI, TAKASHI
To: SEIKO INSTRUMENTS INC.
Reel/Frame 022554/0285 →
Priority Claims (1)
JP 2008-033069 · Feb 14, 2008 · national
Continuity (1)
Related Publication 20090205178A1 · Aug 20, 2009