Fabrication method for organic electroluminescent display with reflection-reducing properties
An organic electroluminescent device and method for fabricating the same are provided. The organic electroluminescent device comprises an anode. An organic luminescent layer is formed over the anode. A partially light-transmitting layer is formed over the organic luminescent layer. A protection layer is formed over the partially light-transmitting layer. A reflection-reducing layer is formed over the protection layer. A cathode is formed over the reflection-reducing layer.
1. A method for fabricating an organic electroluminescent device, comprising:
providing a substrate;
forming an anode over a portion of the substrate;
forming an organic luminescent layer over the anode;
forming a partially light-transmitting layer over the organic luminescent layer;
forming a first protection layer over the partially light-transmitting layer, wherein the first protection layer comprises copper phthalocyanine;
forming a reflection-reducing layer over the first protective layer;
forming a second protection layer over the reflection-reducing layer; and
forming a cathode over the second protection layer, whereby the first protection layer prevents the partially light-transmitting layer from oxidation during formation of the reflection-reducing layer, and the second protection layer prevents the reflection-reducing layer from oxidation during formation of the cathode.
2. The method as claimed in claim 1 , wherein the first protection layer is formed by an evaporation process.
3. The method as claimed in claim 1 , wherein the second protection layer is formed by an evaporation process.
4. The method as claimed in claim 1 , wherein the partially light-transmitting layer is formed by a sputtering process.
5. The method as claimed in claim 1 , wherein the reflection-reducing layer is formed by a sputtering process.
6. The method as claimed in claim 1 , wherein the second protection layer comprises copper phthalocyanine.
7. The method as claimed in claim 1 , wherein the first protection layer has a thickness of about 50-1000 Å.
8. The method as claimed in claim 6 , wherein the second protection layer has a thickness of about 50-1000 Å.
9. The method as claimed in claim 1 , wherein the partially light-transmitting layer has a thickness of about 50-150 Å.
10. The method as claimed in claim 1 , wherein the reflection-reducing layer has a thickness of about 100-3000 Å.