Semiconductor die package and method for making the same
Semiconductor die packages are disclosed. An exemplary semiconductor die package includes a premolded substrate. The premolded substrate can have a semiconductor die attached to it, and an encapsulating material may be disposed over the semiconductor die.
1. A method comprising:
obtaining a premolded substrate including a leadframe structure and a molding material, wherein the leadframe structure includes a first conductive portion, a second conductive portion, and an intermediate portion between the first conductive portion and the second conductive portion;
cutting the intermediate portion to electrically isolate the first conductive portion from the second conductive portion, and to form a gap;
attaching a semiconductor die to the substrate; and
electrically coupling the first and second conductive portions to the semiconductor die, and wherein the method further comprises,
after attaching the die to the semiconductor substrate, encapsulating the semiconductor die using an encapsulating material, wherein the encapsulating material fills the gap between the first conductive portion and the second conductive portion.
2. The method of claim 1 wherein the intermediate portion is formed using an etching process.
3. The method of claim 1 wherein the surfaces of the first and second conductive portions are substantially coplanar with an exterior surface of the molding material.
4. The method of claim 1 wherein electrically coupling the first conductive portion and the second conductive portion to the semiconductor die comprises wirebonding the first conductive portion to the semiconductor die and wirebonding the second conductive portion to the semiconductor die.
5. The method of claim 1 wherein cutting comprises using a saw, a laser, or a water jet to cut the intermediate portion.
6. The method of claim 1 wherein the premolded substrate is in an array of premolded substrates.
7. The method of claim 1 wherein the conductive portions do not extend past the molding material in the lateral direction.
8. The method of claim 1 wherein the semiconductor die is attached to the substrate after the intermediate portion is cut.
9. The method of claim 1 wherein the first and second conductive portions are electrically coupled to the semiconductor die after the intermediate portion is cut.
10. A method for forming a semiconductor die package comprising:
forming a substrate comprising a conductive surface and a recess;
filling the recess with a molding material;
mounting a first chip on the molding material; and
mounting a die on the conductive surface of the substrate.
11. The method of claim 10 wherein the chip is a control chip and the die is a MOSFET die.
12. The method of claim 10 wherein the die is a first die and wherein the package comprises a second die, wherein the second die is also mounted on the conductive surface of the substrate.
13. The method of claim 12 wherein the first die is a first MOSFET die and the second die is a second MOSFET die.
14. The method of claim 13 wherein the first MOSFET die is a high side MOSFET die and the second MOSFET die is a low side MOSFET die.