IP Library Granted Patent US 8,188,498
Granted Patent B2
US 8,188,498 · App. 12/622,613 · Granted May 29, 2012

Light emitting device package

Assignee: LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 8,188,498
App. No.
12/622,613
Granted
May 29, 2012
Kind
B2
Abstract

A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.

Claims (47)

1. A light emitting device package, comprising:

a plurality of lead electrodes disposed to be spaced apart from each other;

a light emitting device on at least one of the plurality of lead electrodes; and

a package body having an upper surface, a lower surface, and an opening passing through the upper surface to the lower surface thereof, the package body being disposed around the light emitting device and being configured to reflect light emitted from the light emitting device,

wherein the opening of the package body has an inclined surface configured to be upwardly broadened,

at least one of the plurality of lead electrodes has a recessed portion extending along a portion of the inclined surface of the opening,

a portion of a bottom surface of the recessed portion is exposed at the lower surface of the package body,

the plurality of lead electrodes comprise a first lead electrode and a second lead electrode spaced apart from each other, wherein the first lead electrode and the second lead electrode extend to the outside of the package body,

a separation region is disposed between the first lead electrode and the second lead electrode, the separation region being disposed on the opening of the package body, and

the exposed portion of the bottom surface of the recessed portion is substantially flush with the lower surface of the package body.

2. The light emitting device package according to claim 1 , wherein the inclined surface of the upper opening of the package body is substantially parallel to the inclined surface of the lower surface of the package body.

3. The light emitting device package according to claim 1 , wherein the package body has a recess with reference to edges of the package body.

4. The light emitting device package according to claim 1 , wherein at least one of the plurality of lead electrodes is extended from the opening of the package body to the outside of the package body.

5. The light emitting device package according to claim 1 , further comprising a phosphor layer disposed around the light emitting device in the opening of the package body.

6. The light emitting device package according to claim 1 , further comprising a resin layer disposed in the opening of the package body.

7. The light emitting device package according to claim 6 , further comprising a lens layer disposed on the resin layer.

8. The light emitting device package according to claim 1 , wherein the opening of the package body has a first cavity and a second cavity connected to the first cavity, and

the plurality of lead electrodes comprise the second lead electrode extending from the first cavity to the outside of the package body, and the first lead electrode spaced apart from the second lead electrode, the first lead electrode extending to the outside of the package body through the second cavity.

9. The light emitting device package according to claim 8 , wherein the first lead electrode comprises the recessed portion where the light emitting device is disposed, and

the first lead electrode that functions as a reflective structure.

10. The light emitting device package according to claim 9 , wherein the recessed portion of the first electrode corresponds to the second cavity.

11. The light emitting device package according to claim 8 , wherein a bottom surface of the recessed portion of the first lead electrode that corresponds to the second cavity is flush with the lower surface of the package body.

12. The light emitting device package according to claim 1 , wherein the separation region is disposed at a bottom of the first cavity.

13. The light emitting device package according to claim 8 , wherein both of the first lead electrode and the second lead electrode comprise a lead frame or a metal layer.

14. A light unit, comprising:

a light emitting device package, the light emitting device package including:

a plurality of lead electrodes disposed to be spaced apart from each other;

a light emitting device on at least one of the plurality of lead electrodes; and

a package body having an upper surface, a lower surface, and an opening passing through the upper surface to the lower surface thereof, the package body being disposed around the light emitting device and being configured to reflect light emitted from the light emitting device,

wherein the opening of the package body has an inclined surface configured to be upwardly broadened,

at least one of the plurality of lead electrodes has a recessed portion extending along a portion of the inclined surface of the opening,

a portion of a bottom surface of the recessed portion is exposed at the lower surface of the package body,

wherein the plurality of lead electrodes comprise a first lead electrode and a second lead electrode spaced apart from each other, wherein the first lead electrode and the second lead electrode extend to the outside of the package body,

a separation region is disposed between the first lead electrode and the second lead electrode, the separation region being disposed on the opening of the package body, and

the exposed portion of the bottom surface of the recessed portion is substantially flush with the lower surface of the package body.

15. The light unit according to claim 14 , wherein the package body has a recess with reference to edges of the package body.

16. The light unit according to claim 14 , wherein at least one of the plurality of lead electrodes is extended from the opening of the package body to the outside of the package body.

17. The light unit according to claim 14 , further comprising a phosphor layer disposed around the light emitting device in the opening of the package body.

18. The light unit according to claim 14 , further comprising a resin layer disposed in the opening of the package body.

19. The light unit according to claim 14 , further comprising a lens layer disposed on the resin layer.

20. The light unit according to claim 14 , wherein the opening of the package body has a first cavity and a second cavity connected to the first cavity, and

the plurality of lead electrodes comprises the second lead electrode extending from the first cavity to the outside of the package body, and the first lead electrode spaced apart from the second lead electrode, the first lead electrode extending to the outside of the package body through the second cavity.

21. The light unit according to claim 20 , wherein the first lead electrode comprises the recessed portion where the light emitting device is disposed, and

the first lead electrode that functions as a reflective structure.

22. The light unit according to claim 21 , wherein the recessed portion of the first electrode corresponds to the second cavity.

23. The light unit according to claim 20 , wherein a bottom surface of the recessed portion of the first lead electrode that corresponds to the second cavity is flush with the lower surface of the package body.

24. The light unit according to claim 20 , wherein the separation region is disposed at a bottom of the first cavity.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 4, 2024
From: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
To: FAIRLIGHT INNOVATIONS, LLC
Reel/Frame 068839/0745 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: LG INNOTEK CO., LTD.
To: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.
Reel/Frame 056366/0335 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 24, 2009
From: KIM, WAN HO; PARK, JUN SEOK
To: LG INNOTEK CO., LTD.
Reel/Frame 023562/0388 →
Priority Claims (1)
KR 10-2008-0117579 · Nov 25, 2008 · national
Continuity (1)
Related Publication 20100133560A1 · Jun 3, 2010