Ultrasound transducer with improved acoustic performance
A system for improving the acoustic performance of an ultrasound transducer by reducing artifacts within the acoustic spectrum is disclosed. The system includes an acoustic layer having an array of acoustic elements, a dematching layer coupled to the acoustic layer and having an acoustic impedance greater than an acoustic impedance of the acoustic layer, and an interposer layer coupled to the dematching layer and comprising a substrate and a plurality of conductive element. The interposer layer is formed to have an acoustic impedance lower than the acoustic impedance of the dematching layer. The ultrasound transducer also includes an integrated circuit coupled to the interposer layer and electrically connected to the array of acoustic elements through the dematching layer and the interposer layer.
1. An ultrasound transducer comprising:
an acoustic layer having an array of acoustic elements;
a dematching layer coupled to the acoustic layer and having an acoustic impedance greater than an acoustic impedance of the acoustic layer;
an interposer layer coupled to the dematching layer and comprising a substrate and a plurality of conductive elements, the interposer layer having an acoustic impedance lower than the acoustic impedance of the dematching layer; and
an integrated circuit coupled to the interposer layer and electrically connected to the array of acoustic elements through the dematching layer and the interposer layer.
2. The ultrasound transducer of claim 1 wherein the interposer layer substrate comprises an electrically non-conductive substrate having a plurality of vias formed therein; and
wherein the plurality of conductive elements comprises an electrically conductive path in each of the plurality of vias.
3. The ultrasound transducer of claim 2 wherein each of the substrate and the electrically conductive path has an acoustical impedance of less than approximately 10 MRayls.
4. The ultrasound transducer of claim 2 wherein the electrically conductive path comprises a silver epoxy filled in each of the plurality of vias.
5. The ultrasound transducer of claim 2 wherein the electrically conductive path comprises:
an electrically conductive metal interconnect formed on the substrate and extending through each of the plurality of vias; and
an electrically non-conductive epoxy filled-in over each metal interconnect and in a remainder of each of the plurality of vias.
6. The ultrasound transducer of claim 2 wherein the interposer layer further comprises a metal core embedded in the substrate, the metal core having a plurality of perforations formed therein; and
wherein the plurality of vias extend through at least a portion of the plurality of perforations.
7. The ultrasound transducer of claim 2 wherein the interposer layer comprises:
a first connection region configured to electrically connect the integrated circuit to the array of acoustic elements, the first connection region having the plurality of vias formed therein;
a second connection region configured to electrically connect the integrated circuit to system connections including at least one of a signal input/output connection, a power and control connection, and a ground and duplicate power connection.
8. The ultrasound transducer of claim 7 wherein the second connection region comprises at least one of pad connections, trace connections, epoxy-filled single layer vias, and epoxy-filled through vias.
9. The ultrasound transducer of claim 2 wherein a pitch of the plurality of vias formed in the substrate matches a pitch of the array of acoustic elements.
10. The ultrasound transducer of claim 2 wherein the substrate comprises a multi-layer substrate including at least a top substrate layer and a bottom substrate layer having single layer vias formed therethrough, and wherein a pitch of the single layer vias in the top substrate layer differs from a pitch of the single layer vias in the bottom substrate layer.
11. The ultrasound transducer of claim 1 further comprising a lossy backing layer coupled to a back surface of the integrated circuit opposite the interposer layer.
12. A method for manufacturing an ultrasound transducer comprising:
providing an interposer layer;
forming a plurality of vias in the interposer layer;
adding an electrically conductive material within the vias;
coupling an acoustic layer to a dematching layer, the dematching layer having an acoustic impedance greater than an acoustic impedance of the acoustic layer and greater than an acoustic impedance of the interposer layer;
coupling the interposer layer to the dematching layer; and
coupling a beam forming electronics package to the interposer layer, the beam forming electronics package having a plurality of connection pads formed thereon and being electrically coupled to the acoustic layer by way of the interposer layer.
13. The method of claim 12 further comprising dicing the acoustic layer and the dematching layer to form an array of transducer elements.
14. The method of claim 13 wherein providing the interposer layer comprises providing an organic substrate; and
wherein forming the plurality of vias comprises forming the plurality of vias in the organic substrate at a pitch equal to a pitch of the transducer elements.
15. The method of claim 13 wherein providing the interposer layer comprises providing a multi-layer organic substrate having at least a top substrate layer and a bottom substrate layer; and
wherein forming the plurality of vias comprises:
forming a plurality of vias in the bottom substrate layer at a pitch equal to a pitch of the plurality of connection pads on the beam forming electronics package; and
forming a plurality of vias in the top substrate layer at a pitch equal to a pitch of the transducer elements.
16. The method of claim 13 wherein coupling the beam forming electronics package to the interposer layer comprises:
coupling a first group of connection pads on the beam forming electronics package to a first connection region of the interposer layer, thereby electrically connecting the beam forming electronics package to the array of transducer elements; and
coupling a second group of connection pads on the beam forming electronics package to a second connection region of the interposer layer, thereby electrically connecting the beam forming electronics package to system connections including at least one of a signal input/output connection, a power and control connection, and a ground and duplicate power connection.
17. The method of claim 16 wherein coupling the second group of connection pads to the second connection region comprises coupling the second group of connection pads to the second connection region through at least one of pad connections, trace connections, single layer vias, and through vias.
18. The method of claim 12 wherein adding the electrically conductive material within the vias comprises filling the vias with an epoxy having an acoustic impedance substantially similar to the acoustic impedance of the interposer layer.
19. The method of claim 12 wherein adding the electrically conductive material within the vias comprises:
forming an electrically conductive metal interconnect within each of the vias; and
filling a remaining portion of each of the vias with an electrically non-conductive epoxy having an acoustic impedance substantially similar to the acoustic impedance of the interposer layer.
20. An ultrasound transducer configured for use in an invasive probe, the ultrasound transducer comprising:
an acoustic layer having an array of acoustic elements;
a dematching layer coupled to the acoustic layer and having an acoustic impedance greater than an acoustic impedance of the acoustic layer;
beam forming electronics configured to send signals to the acoustic layer and receive signals from the acoustic layer and having a plurality of connection pads formed thereon; and
an interposer layer coupled to the dematching layer, the interposer layer comprising:
an electrically non-conductive substrate having an acoustic impedance lower than the acoustic impedance of the dematching layer, the substrate having a plurality of vias formed therein;
a first connection region configured to electrically connect the beam forming electronics to the acoustic layer and having a plurality of electrically conductive pathways extending through the plurality of vias; and
a second connection region configured to electrically connect the beam forming electronics to system connections including at pg, 32 least one of a signal input/output connection, a power and control connection, and a ground and duplicate power connection.
21. The ultrasound transducer of claim 20 wherein the first connection region comprises:
a plurality of top surface connection pads; and
a plurality of bottom surface connection pads;
wherein a pitch of the top surface connection pads matches a pitch of the array of acoustic elements, and wherein a pitch of the bottom surface connection pads matches a pitch of the beam forming electronics connection pads.
22. The ultrasound transducer of claim 20 wherein the second connection region comprises at least one of pad connections, trace connections, epoxy-filled single layer vias, and epoxy-filled through vias.
23. The ultrasound transducer of claim 20 wherein each of the substrate and the conductive pathways of the interposer layer have an acoustical impedance of less than approximately 10 MRayls.
24. The ultrasound transducer of claim 20 wherein the interposer layer substrate comprises a polyimide material, and wherein the filler material comprises silver epoxy.
25. The ultrasound transducer of claim 20 wherein the interposer layer further comprises a metal core embedded in the substrate and with the metal core having a plurality of perforations formed therein, and wherein the plurality of vias extend through at least a portion of the plurality of perforations.