Mold for optical device with anti-reflection structure, method for producing the same, and optical device
View Patent ↗A process for producing through simple operations a molding die for optical device having an antireflective structure of nano-order microscopic uneven plane on a substratum surface. The molding die for optical device having microscopic uneven plane (antireflective structure die plane) on a surface of substratum is produced by a process comprising forming one or more etching transfer layers on substratum; forming thin film for formation of semispherical microparticles on the etching transfer layers; causing the thin film to undergo aggregation, or decomposition, or nucleation of the material by the use of any of thermal reaction, photoreaction and gas reaction or a combination of these reactions so as to form multiple semispherical islandlike microparticles; and using the multiple islandlike microparticles as a protective mask, carrying out sequential etching of the etching transfer layers and substratum by reactive gas to thereby form a conical pattern on the microscopic surface of the substratum.
1. A method of producing a mold for an optical device for molding the optical device with an anti-reflection structure of a fine depressed and elevated surface formed on a surface of a substrate, comprising:
forming one or more etching transfer layers on the substrate;
forming a thin film comprising a thin film material on the etching transfer layer;
causing aggregation or nucleation of the thin film material to form a plurality of island-like fine particles composed of the thin film material by using a heating reaction or a photoreaction; and
etching the etching transfer layer and the substrate in order, by using the plurality of island-like fine particles as a protection mask to form a fine elevated pattern on a surface of the etching transfer layer or the surface of the substrate.
2. A method of producing a mold for an optical device with an anti-reflection structure according to claim 1 , wherein the plurality of island-like fine particles each have a size in the order of nano meters and form a nano pattern in such a manner as to be arranged at a random while holding an interval of a wavelength or less of light as a target, with each other.
3. A method of producing a mold for an optical device with an anti-reflection structure according to claim 1 , wherein the thin film material is made of a material containing silver, gold, platinum, or palladium as a main component, or an oxide or a nitride containing any one of silver, gold, platinum, palladium, tungsten, bismuth, and tellurium as a main component.
4. A method of producing a mold for an optical device with an anti-reflection structure according to claim 1 , wherein the plurality of the island-like fine particles has an average particle size of 5 nm to 1000 nm and an average interval between the plurality of island-like fine particles is in a range of 10 nm to 2000 nm.
5. A method of producing a mold for an optical device with an anti-reflection structure according to claim 1 , wherein the substrate is made of a metal or a non-metal containing silica glass, resin, silicon, gallium nitride, gallium arsenide, indium phosphor, nickel, iron, titanium, carbon, sapphire or carbon nitride as a main component.
6. A method of producing a mold for an optical device with an anti-reflection structure according to claim 1 , wherein the etching layer is composed of one layer made of an oxide, a nitride or a carbide, or multi layers made of any of the oxide, the nitride and the carbide.
7. A method of producing a mold, comprising:
forming one or more etching transfer layers on a substrate;
forming a thin film comprising a thin film material on the etching transfer layer;
causing aggregation or nucleation of the thin film material to form a plurality of island-like fine particles composed of the thin film material by using a heating reaction or a photoreaction; and
etching the etching transfer layer and the substrate in order, by using the plurality of island-like fine particles as a protection mask to form a fine elevated pattern on a surface of the etching transfer layer or a surface of the substrate.