IP Library Granted Patent US 8,230,562
Granted Patent B2
US 8,230,562 · App. 11/938,078 · Granted Jul 31, 2012

Method of fabricating an acoustic resonator comprising a filled recessed region

Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.
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Quick Facts
Patent No.
US 8,230,562
App. No.
11/938,078
Granted
Jul 31, 2012
Kind
B2
Abstract

A method for fabricating an acoustic resonator comprises providing a substrate; fabricating a first electrode adjacent the substrate; fabricating a piezoelectric layer adjacent the first electrode; depositing electrode material to form a second electrode up to a first thickness adjacent the piezoelectric layer; depositing a first photo mask over the second electrode; depositing additional electrode material to form the second electrode up to a second thickness; removing the photo mask thereby forming a recessed region in the second electrode; and filling the recessed region with a fill material.

Claims (14)

1. A method for fabricating an acoustic resonator comprising:

providing a substrate;

fabricating a first electrode adjacent the substrate;

fabricating a piezoelectric layer adjacent the first electrode;

depositing electrode material to form a second electrode up to a first thickness adjacent the piezoelectric layer;

depositing a first photo mask over the second electrode;

depositing additional electrode material over at least a portion of the first photo mask to form the second electrode up to a second thickness;

removing the photo mask thereby forming a recessed region in the second electrode; and

filling the recessed region with a fill material.

2. The method of claim 1 , further including depositing a second photo mask over the second electrode before filling the recessed region.

3. The method of claim 1 further including forming a depression in the substrate.

4. The method of claim 1 further including filling the recessed region with a different material than the electrode material.

5. The method of claim 1 , wherein filling the recessed region includes filling with a material selected from the group consisting of:

dielectrics, metals, metal alloys, piezoelectrics, Mo, Pt, Al, Cu, W, Au, Ag, polyimide, BCB, SiO 2 , Si 3 N 4 , AN, ZnO, LiNbO 3 , PZT, LiTaO 3 , and Al 2 O 3 .

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 09/05/2018 PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0133. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0456 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0133 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0703 →
Continuity (2)
Division 11100311 · Apr 6, 2005
Related Publication 20080060181A1 · Mar 13, 2008