Light emitting device, package, and system
A light emitting device includes a first semiconductor layer of a first conductivity type, an active layer adjacent to the first semiconductor layer, a second semiconductor layer of a second conductivity type and provided adjacent to the active layer, and a passivation layer provided on a side surface of the active layer. The passivation layer may be a semiconductor layer of one of the first conductivity type, the second conductivity type or a first undoped semiconductor layer. A first electrode may be coupled to the first semiconductor layer and a second electrode may be coupled to the second semiconductor layer.
1. A light emitting device comprising:
a first semiconductor layer of a first conductivity type;
an active layer adjacent to the first semiconductor layer;
a second semiconductor layer of a second conductivity type and provided adjacent to the active layer;
a passivation layer provided on a side surface of the active layer, the passivation layer being a semiconductor layer of one of the first conductivity type, the second conductivity type or a first undoped semiconductor layer;
a first electrode coupled to the first semiconductor layer; and
a second electrode coupled to the second semiconductor layer, wherein the passivation layer comprises Al x In y Ga 1-x-y N, where 0≦x≦1, 0≦y≦1, and 0≦x+y≦1.
2. The light emitting device according to claim 1 , further comprising a protective layer on the second semiconductor layer.
3. The light emitting device of claim 1 , wherein side surfaces of the first semiconductor layer, the active layer and the second semiconductor layer are tapered.
4. The light emitting device of claim 1 , further comprising a second undoped semiconductor layer over the first semiconductor layer.
5. The light emitting device of claim 2 , wherein the protective layer includes a same material as the passivation layer.
6. The light emitting device of claim 1 , wherein the passivation layer is provided on a side surface of at least one of the first semiconductor layer or the second semiconductor layer.
7. The light emitting device of claim 4 , wherein the second undoped semiconductor layer includes an opening to expose the first semiconductor layer, and the first electrode is provided in the opening to contact the first semiconductor layer.
8. The light emitting device of claim 2 , wherein the second electrode is provided on the protective layer.
9. The light emitting device of claim 1 , wherein a thickness of the passivation layer is no greater than 100 angstroms.
10. The light emitting device of claim 2 , wherein the second electrode contacts at least one of the protective layer or the second semiconductor layer.
11. The light emitting device of claim 2 , wherein the passivation layer has a higher resistivity than the protective layer.
12. A light emitting device, comprising:
a first semiconductor layer of a first conductivity type;
an active layer adjacent to the first semiconductor layer;
a second semiconductor layer of a second conductivity type provided adjacent to the active layer;
a passivation layer provided on a side surface of the active layer, the passivation layer being a semiconductor layer of one of the first conductivity type, the second conductivity type or a first undoped semiconductor layer;
a first electrode coupled to the first semiconductor layer; and
a second electrode coupled to the second semiconductor layer, wherein a largest width of the first semiconductor layer is greater than a largest width of at least one of the active layer or the second semiconductor layer.
13. The light emitting device of claim 12 , wherein the largest width of the active layer is greater than the largest width of the second semiconductor layer.
14. The light emitting device of claim 12 , further comprising:
a protective layer over the second semiconductor layer;
wherein the passivation layer has a higher resistivity than the protective layer.
15. A light emitting device, comprising:
a first semiconductor layer of a first conductivity type;
an active layer adjacent to the first semiconductor layer;
a second semiconductor layer of a second conductivity type provided adjacent to the active layer;
a passivation layer provided on a side surface of the active layer, the passivation layer being a semiconductor layer of one of the first conductivity type, the second conductivity type or a first undoped semiconductor layer;
a protective layer over the second semiconductor layer;
a first electrode coupled to the first semiconductor layer; and
a second electrode coupled to the second semiconductor layer,
wherein the protective layer has a thickness greater than the passivation layer.
16. The light emitting device of claim 15 , wherein the passivation layer has a higher resistivity than the protective layer.