Substrate processing apparatus and semiconductor device producing method
View Patent ↗Disclosed is a substrate processing apparatus, including a reaction tube to process a substrate therein, wherein the reaction tube includes an outer tube, an inner tube disposed inside the outer tube, and a support section to support the inner tube, the inner tube and the support section are made of quartz or silicon carbide, and a shock-absorbing member is provided between the support section and the inner tube.
1. A substrate processing apparatus, comprising a reaction tube to process a substrate therein, wherein
the reaction tube comprises an outer tube, an inner tube disposed inside the outer tube, and a support section to support the inner tube,
the inner tube and the support section are made of quartz or silicon carbide, and
a shock-absorbing member is provided between the support section and the inner tube.
2. The substrate processing apparatus according to claim 1 , wherein the shock-absorbing member is made of a material which is deformed or damaged by a force smaller than a force by which quartz is deformed or damaged.
3. The substrate processing apparatus according to claim 2 , wherein the shock-absorbing member is made of a material whose hardness is smaller than that of quartz.
4. The substrate processing apparatus according to claim 3 , wherein the shock-absorbing member is made of a material including carbon or a material including silicon.
5. The substrate processing apparatus according to claim 4 , wherein the shock-absorbing member is made of at least one material selected from a group consisting of graphite, glassy carbon and graphite whose surface is covered with glassy carbon.
6. The substrate processing apparatus according to claim 4 , wherein the shock-absorbing member is made of a material whose hardness is smaller than that of quartz, and a surface of the shock-absorbing member is coated with at least one material selected from a group consisting of Si, SiO 2 , Si 3 N 4 and SiC.
7. The substrate processing apparatus according to claim 4 , wherein the shock-absorbing member is made of a material including carbon, and a surface of the shock-absorbing member is coated with at least one material selected from a group consisting of Si, SiO 2 , Si 3 N 4 and SiC.
8. The substrate processing apparatus according to claim 2 , wherein the shock-absorbing member is made of single-crystal silicon.
9. The substrate processing apparatus according to claim 1 , wherein the outer tube and the support section are made of quartz, and the support section is welded to an inner all of the outer tube.
10. The substrate processing apparatus according to claim 1 , wherein the inner tube, the outer tube and the support section are made of quartz.
11. The substrate processing apparatus according to claim 1 , wherein at least one of the shock-absorbing member, the support section and the inner tube is provided with a step portion which restricts motion of the shock-absorbing member or the inner tube in a horizontal direction.
12. The substrate processing apparatus according to claim 11 , the shock-absorbing member is provided with the step portion.
13. The substrate processing apparatus according to claim 11 , wherein each of the shock-absorbing member and the support section is provided with the step portion.
14. The substrate processing apparatus according to claim 11 , wherein each of the inner tube and the support section is provided with the step portion.
15. The substrate processing apparatus according to claim 11 , wherein each of the shock-absorbing member and the inner tube is provided with the step portion.
16. A substrate processing apparatus, comprising a reaction tube to process a substrate therein, wherein
the reaction tube comprises an outer tube, an inner tube disposed inside the outer tube, and a support section to support the inner tube, and
a shock-absorbing member is provided between the support section and the inner tube, the shock-absorbing member being made of a material which is deformed or damaged by a force smaller than a force by which materials of the support section and the inner tube are deformed or damaged.
17. A producing method of a semiconductor device, comprising:
loading a substrate into a reaction tube, the reaction tube comprising an outer tube, an inner tube disposed inside the outer tube, and is support section to support the inner tube, the inner tube and the support section being made of quartz or silicon carbide, and a shock-absorbing member being provided between the support section and the inner tube;
processing the substrate by supplying processing gas into the reaction tube; and
unloading the processed substrate from the reaction tube.
18. A reaction tube assembly, comprising:
an outer tube;
an inner tube disposed inside the outer tube, the inner tube being made of quartz or silicon carbide;
a support section to support the inner tube, the support section being made of quartz or silicon carbide; and
a shock-absorbing member provided between the support section and the inner tube.