IP Library Granted Patent US 8,248,798
Granted Patent B2
US 8,248,798 · App. 12/871,188 · Granted Aug 21, 2012

Thermal control system for rack mounting

Assignee: ThermoTek, Inc.
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Quick Facts
Patent No.
US 8,248,798
App. No.
12/871,188
Granted
Aug 21, 2012
Kind
B2
Abstract

A thermal control system of a 3 U height includes various modules for providing temperature control in a rack environment. The modules may be, for example, a power module, user interface module, various different pump assemblies, various different models of fan assemblies, HTAs, and/or a serial communication interfaces.

Claims (32)

1. A precision thermal control method of heating and cooling select equipment utilizing a heat transfer fluid in conjunction with an external heat exchanger, the method comprising the steps of:

providing a chassis having a height of no more than 3 U, the chassis comprising:

a front face;

a rear face

a continuous heat transfer chassis region occupying over half of an available internal space of the chassis, the continuous heat transfer chassis region not being coextensive with the available internal space of the chassis, the continuous heat transfer chassis region extending from an interior aspect of the front face to an interior aspect of the rear face; and

a continuous pump region comprising a pump, the continuous pump region occupying less than half of the available internal space of the chassis, the continuous pump region extending from an interior aspect of the front face to the interior aspect of the rear face, the continuous pump chassis region and the continuous heat transfer chassis region positioned adjacent to each other along a boundary oriented parallel to a depth of the chassis;

securing within the chassis a first plurality of fan assemblies disposed adjacent to the front face, the first plurality of fan assemblies connecting the continuous heat transfer chassis region with the exterior environment;

securing within the chassis a second plurality of fan assemblies disposed adjacent to the rear face, the second plurality of fan assemblies connecting the continuous heat transfer chassis region with the exterior environment, the second plurality of fan assemblies operable to allow an airflow through the continuous heat transfer chassis region;

providing a first plurality of fluid connections on a portion of the front face corresponding to the boundary;

providing a second plurality of fluid connections on a portion of the rear face corresponding to the boundary;

securing to said chassis within the continuous heat transfer chassis region a plurality of heat transfer assembly modules of a type formed with a plurality of low profile extrusions having micro channels formed therein for the flow of the heat transfer fluid therethrough, the plurality of heat transfer assembly modules oriented parallel to each other and perpendicular to the depth of the chassis;

orienting the plurality of heat transfer assembly modules within the continuous heat transfer chassis region such that a plurality of spaces are disposed there between;

securing a power supply within said chassis for powering said plurality of heat transfer assembly modules;

circulating the heat transfer fluid through each of the plurality of low profile extrusions in a direction perpendicular to the depth of the chassis;

circulating air through the continuous heat transfer region in a direction parallel to the depth of the chassis; and

pumping said heat transfer fluid in a closed loop to said external heat exchanger for the cooling of said heat transfer fluid.

2. The method as set forth in claim 1 , wherein said precision thermal control method is implemented inside an isolated closed environment.

3. The method as set forth in claim 1 , further comprising circulating the heat transfer fluid in a closed loop to cool or heat the select equipment.

4. The method as set forth in claim 3 , wherein the select equipment and the chassis are disposed in a conventional system rack.

5. The method as set forth in claim 3 , further comprising fins extending from said plurality of low profile extrusions for cooling therewith.

6. The method as set forth in claim 3 , further comprising using a water/glycol mixture for the heat transfer fluid.

7. The method as set forth in claim 3 , further comprising using a water/alcohol mixture for the heat transfer fluid.

8. The method as set forth in claim 3 , further comprising using distilled water for the heat transfer fluid.

9. The method as set forth in claim 3 , further comprising using dionized water for the heat transfer fluid.

10. The method as set forth in claim 1 , further comprising allowing a user to set a range of satisfactory temperature of the heat transfer fluid.

11. The method as set forth in claim 10 , further comprising adjusting a fan speed of the first plurality of fan assemblies and/or the second plurality of fan assemblies and a flow rate of the heat transfer fluid automatically in at least partial dependence on the range of satisfactory temperature.

12. The method as set forth in claim 10 , further comprising recording a temperature of the heat transfer fluid.

13. The method as set forth in claim 12 , further comprising displaying recorded temperature of the heat transfer fluid.

14. The method as set forth in claim 10 , further comprising activating an alarm when a temperature of the heat transfer fluid is outside the range of satisfactory temperature.

15. The method as set forth in claim 12 , further comprising monitoring airflow across the micro channels, the fluid flow of the heat transfer fluid, and the performance of the micro channels.

16. The method as set forth in claim 15 , further comprising maintaining the temperature of the heat transfer fluid to within one-tenth of one degree Celsius of a temperature of the range of satisfactory temperature set by the user.

17. The method as set forth in claim 1 , further comprising adapting the chassis to stand in one of a vertical direction or a horizontal position by adding a plurality of support feet to at least one side of the chassis.

Assignments (3)
SECURITY AGREEMENT Recorded Nov 12, 2020
From: THERMOTEK, INC.
To: OXFORD FINANCE LLC, AS AGENT
Reel/Frame 054401/0337 →
SECURITY AGREEMENT Recorded Oct 22, 2020
From: THERMOTEK, INC.
To: OXFORD FINANCE LLC, AS AGENT
Reel/Frame 054214/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2010
From: PARISH, OVERTON L.; BALACHANDRAN, NIRAN; QUISENBERRY, TONY; LEGGETT, WILLIAM F.
To: THERMOTEK, INC.
Reel/Frame 025040/0250 →
Continuity (4)
Continuation 12176084 · Jul 18, 2008
Continuation 11202885 · Aug 12, 2005
Provisional Application 60601013 · Aug 12, 2004
Related Publication 20110209850A1 · Sep 1, 2011