Laser processing method for workpiece
A processing method for a workpiece which includes a first modified region forming step of forming first modified regions along first division lines and second division lines near the front side of the workpiece, a second modified region forming step of forming second modified regions at intersecting regions between the first division lines and the second division lines at predetermined positions between the back side of the workpiece and the first modified regions formed in the workpiece by performing the first modified region forming step, and a dividing step of applying an external force to the workpiece after performing the first and second modified region forming steps to thereby divide the workpiece along the first division lines and the second division lines into individual chips.
1. A processing method for dividing a workpiece along a plurality of first division lines and a plurality of second division lines intersecting said first division lines, the front side of said workpiece being partitioned by said first division lines and said second division lines into a plurality of regions where a plurality of functional devices are respectively formed, said processing method comprising:
a first modified region forming step of applying a pulsed laser beam having a transmission wavelength to said workpiece along said first division lines and said second division lines to thereby form a plurality of first modified regions in said workpiece near the front side of said workpiece;
a second modified region forming step of applying said pulsed laser beam to a plurality of intersecting regions between said first division lines and said second division lines to thereby form a plurality of second modified regions at predetermined positions between the back side of said workpiece and said first modified regions formed or to be formed in said workpiece; and
a dividing step of applying an external force to said workpiece after performing said first modified region forming step and said second modified region forming step to thereby divide said workpiece along said first division lines and said second division lines into a plurality of individual chips.
2. The processing method according to claim 1 , further comprising a protective tape attaching step of attaching an expandable protective tape to the front side of said workpiece;
said dividing step including the step of expanding said protective tape attached to the front side of said workpiece to thereby apply said external force to said workpiece, thus dividing said workpiece along said first division lines and said second division lines.
3. The processing method according to claim 1 , further comprising a protective tape attaching step of attaching a protective tape to the back side of said workpiece;
said dividing step including the step of bending said workpiece toward the back side thereof attached to said protective tape to thereby apply said external force to said workpiece, thus dividing said workpiece along said first division lines and said second division lines.