Semiconductor device, method for producing the same, sensor and electro-optical device

1. A method for producing a semiconductor device, the method comprising:

forming a gate electrode on a substrate;

forming a gate insulation film on the gate electrode;

forming an inorganic oxide film precursor on the gate insulation film and applying ultraviolet laser light to the inorganic oxide film precursor to form an inorganic oxide film, the inorganic oxide film being positioned above the gate electrode and having a carrier density of 10 19 /cm 3 or more;

forming a source electrode and a drain electrode on a different portion of the inorganic oxide film from each other, wherein the source electrode and the drain electrode are in direct contact with the inorganic oxide film and the source electrode and the drain electrode partially covering the inorganic oxide film so as to expose a region of the inorganic oxide film; and

applying an oxidation treatment to the exposed region of the inorganic oxide film thereby the exposed region of the inorganic oxide film to have reduced carrier density of 5×10 16 /cm 3 or less

wherein the inorganic oxide film precursor is formed by a liquid phase method from a liquid comprising an organic solvent and at least one material selected from the group consisting of an inorganic oxide particle, an organic precursor and an organic-inorganic composite precursor.

2. The method for producing a semiconductor device as claimed in claim 1 , wherein the inorganic oxide film comprises at least one element selected from the group consisting of In, Zn, Ga and Sn.

3. A method for producing a semiconductor device, the method comprising:

forming a gate electrode on a substrate;

forming a gate insulation film on the gate electrode;

forming an inorganic oxide film on the gate insulation film, the inorganic oxide film being positioned above the gate electrode, and having a carrier density of 10 19 /cm 3 or more;

forming a source electrode and a drain electrode by a liquid phase method from an inorganic particle dispersion liquid comprising an organic solvent and an inorganic particle, wherein the source electrode and the drain electrode are formed on a different portion of the inorganic oxide film from each other, the source electrode and the drain electrode are in direct contact with the inorganic oxide film, and the source electrode and the drain electrode partially cover the inorganic oxide film so as to expose a region of the inorganic oxide film; and

applying an oxidation treatment to the exposed region of the inorganic oxide film, the source electrode, and the drain electrode, thereby the exposed region of the inorganic oxide film to have the carrier density of 5×10 16 /cm 3 or less,

wherein the inorganic particles are surface-coated with a dispersant, the dispersant being bound to the inorganic particle via a chemical bond breakable by the oxidation treatment, and

wherein the oxidation treatment simultaneously increases the resistance of the exposed region of the inorganic oxide film and decreases the resistance of the source electrode and the drain electrode.

4. The method for producing a semiconductor device as claimed in claim 1 , wherein

the source electrode and the drain electrode are formed by a liquid phase method from an inorganic particle dispersion liquid comprising an organic solvent and an inorganic particle, the inorganic particle being surface-coated with a dispersant, the dispersant being bound to the inorganic particle via a chemical bond breakable by the oxidation treatment, and

the oxidation treatment reduces the carrier density of the exposed region of the inorganic oxide film and a specific resistance value of the source electrode and the drain electrode.

5. The method for producing a semiconductor device as claimed in claim 2 , wherein

the source electrode and the drain electrode are formed by a liquid phase method from an inorganic particle dispersion liquid comprising an organic solvent and an inorganic particle, the inorganic particle being surface-coated with a dispersant, the dispersant being bound to the inorganic particle via a chemical bond breakable by the oxidation treatment, and

the oxidation treatment reduces the carrier density of the inorganic oxide film and a specific resistance value of the source electrode and the drain electrode.

6. The method for producing a semiconductor device as claimed in claim 3 , wherein the method for forming the source electrode and the drain electrode using the liquid phase method comprises coating using a liquid jet technique.

7. The method for producing a semiconductor device as claimed in claim 3 , wherein the inorganic particle comprises, as a main component, at least one inorganic substance selected from the group consisting of Au, Ag, Cu, Pt, Ni, Cr, Rh, Pd, Zn, Co, Mo, Ru, W, Os, Ir, Fe, Mg, Y, Ti, Ta, Nb, Mn, Ge, Sn, Ga, Al, In, and alloys and oxides thereof.

8. The method for producing a semiconductor device as claimed in claim 1 , wherein the oxidation treatment applies, under the presence of oxygen, at least one treatment selected from oxygen radical treatment and heat treatment.

9. The method for producing a semiconductor device as claimed in claim 1 , wherein the substrate comprises a resin substrate.

10. A semiconductor device produced by the method as claimed in claim 1 .

11. A sensor comprising the semiconductor device as claimed in claim 10 .

12. An electro-optical device comprising the semiconductor device as claimed in claim 10 .