Heat conduction board and mounting method of electronic components
A heat conduction board, include a heat dissipation member; a heat conduction member which is arranged on the heat dissipation member and conducts a heat thereto; a lead frame which is formed in a wire pattern shape, and is arranged on the heat conduction member; and a printed circuit board which mounts a second electronic component for controlling a first electronic component; wherein the first electronic component and the printed circuit board are soldered to the lead frame.
1. A heat conduction board, comprising:
a heat dissipation member;
a heat conduction member which is arranged on the heat dissipation member and conducts a heat thereto;
a lead frame which is formed in a wire pattern shape, and is arranged on the heat conduction member; and
a printed circuit board which mounts a second electronic component for controlling a first electronic component,
wherein:
the first electronic component and the printed circuit board are soldered to the lead frame,
the printed circuit board is provided with a contact terminal of a through hole shape, and
the lead frame is provided with a tip part of a L-character shape, wherein the tip part is inserted to the contact terminal and is soldered thereto.
2. A heat conduction board, comprising:
a heat dissipation member;
a heat conduction member which is arranged on the heat dissipation member and conducts a heat thereto;
a lead frame which is formed in a wire pattern shape, and is arranged on the heat conduction member; and
a printed circuit board which mounts a second electronic component for controlling a first electronic component, wherein:
the printed circuit board is provided with a contact terminal of a pad-like, and
the lead frame is provided with a tip part of a Z-character shape, wherein the tip part is surface contact with the contact terminal and is soldered thereto.
3. A heat conduction board, comprising:
a heat dissipation member;
a heat conduction member which is arranged on the heat dissipation member and conducts a heat thereto;
a lead frame which is formed in a wire pattern shape, and is arranged on the heat conduction member; and
a printed circuit board which mounts a second electronic component for controlling a first electronic component, wherein:
the printed circuit board is provided with a contact terminal of a semi-circle shape formed at a edge part, and
the lead frame is provided with a tip part of a L-character shape, wherein the tip part is inserted to the contact terminal and is soldered thereto.