IP Library Granted Patent US 8,287,108
Granted Patent B2
US 8,287,108 · App. 12/114,318 · Granted Oct 16, 2012

Sealing method of remanufactured liquid container

Assignee: Seiko Epson Corporation
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Quick Facts
Patent No.
US 8,287,108
App. No.
12/114,318
Granted
Oct 16, 2012
Kind
B2
Abstract

A method for sealing an ink cartridge is disclosed. A cover film is bonded to the ink cartridge in such a manner as to cover an ink inlet hole formed in the ink cartridge. An opening is formed in the cover film in such a manner as to communicate with the hole of the ink cartridge. The method includes preparing a seal film and bonding the seal film to the cover film with a bonding strength smaller than the bonding strength of the cover film with respect to the ink cartridge in such a manner that the seal film becomes peelable from the cover film, thereby sealing the opening of the cover film.

Claims (15)

1. A liquid container comprising:

a hole forming surface in which a hole is formed;

a cover film bonded to the hole forming surface in such a manner as to cover the hole, the cover film having an opening communicating with the hole; and

a seal film sealing the opening of the cover film, the seal film being bonded to the cover film in such a manner that the seal film becomes peelable from the cover film,

wherein the cover film is formed by stacking a plurality of films including a bonding layer film and a surface layer film, the bonding layer film being welded to the hole forming surface, the surface layer film being arranged to be exposed to the side corresponding to a surface of the cover film,

wherein the seal film is formed by stacking a plurality of films including a first film and a second film, the first film being welded to the surface layer film, the second film being arranged to be exposed to the side corresponding to a surface of the seal film, and

wherein the surface layer film and the second film melt at a melting point higher than the melting point of the first film and exhibit higher heat resistance than the first film.

2. The liquid container according to claim 1 , wherein the cover film is welded to the liquid container, and wherein the seal film is welded to the cover film with a welding strength

smaller than the welding strength of the cover film with respect to the liquid container.

3. The liquid container according to claim 1 , wherein the seal film has a surface that is formed of a resin material and welded to the cover film, and wherein the cover film has a surface that is formed of a resin material of a type different from the type of the resin material of the seal film and welded to the seal film.

4. The liquid container according to claim 1 ,

wherein the bonding layer film and the hole forming surface are formed of resin materials of a same type, and

wherein the surface layer film and the first film are formed of resin materials of different types.

5. The liquid container according to claim 1 , wherein the seal film has a portion that is not bonded to the cover film.

6. The liquid container according to claim 1 , wherein the hole is a liquid inlet hole through which a liquid is introduced into the liquid container, and wherein the cover film has an opening formed in a portion of the cover film that covers the liquid inlet hole.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2008
From: UEHARA, YASUNAO; SEKI, YUICHI; MATSUYAMA, MASAHIDE; OGURA, YASUHIRO
To: SEIKO EPSON CORPORATION
Reel/Frame 021307/0949 →
Priority Claims (1)
JP 2007-121712 · May 2, 2007 · national
Continuity (1)
Related Publication 20080284833A1 · Nov 20, 2008