IP Library Granted Patent US 8,289,463
Granted Patent B2
US 8,289,463 · App. 13/273,460 · Granted Oct 16, 2012

Manufacturing method for a thin film transistor-liquid crystal display having an insulating layer exposing portions of a gate island

Assignee: Beijing BOE Optoelectronics Technology Co., Ltd.
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Quick Facts
Patent No.
US 8,289,463
App. No.
13/273,460
Granted
Oct 16, 2012
Kind
B2
Abstract

A pixel unit of TFT-LCD array substrate and a manufacturing method thereof is disclosed. In the manufacturing method, besides a first insulating layer and a passivation layer, a second insulating layer is adopted to cover the gate island, and forms an opening on the gate island to expose the channel region, the source region and the drain region of the TFT. A gray tone mask and a photoresist lifting-off process are utilized to perform patterning, so that the TFT-LCD array substrate can be achieved with just three masks.

Claims (16)

1. A manufacturing method of a pixel unit of a TFT-LCD array substrate, comprising the steps of:

depositing sequentially on a substrate stacked layers of a gate metal layer, a first gate insulating layer, an active layer, and an ohmic contact layer, and then patterning the stacked layers to form a gate island;

depositing sequentially a second insulating layer and a pixel electrode material layer on the substrate, patterning the second insulating layer and the pixel electrode material layer, so as to form an opening on the gate island to expose the ohmic contact layer in a source region, a drain region, and a channel region of the TFT and form a pixel electrode;

depositing a source/drain metal layer on the substrate, and patterning the source/drain metal layer and the ohmic contact layer exposed in the opening, so as to form on the second insulating layer a source electrode connected with the ohmic contact layer in the source region and a drain electrode connected with the ohmic contact layer in the drain region, and remove the ohmic contact layer on the channel region; and

depositing a passivation layer on the substrate.

2. The manufacturing method according to claim 1 , wherein the passivation layer on the pixel electrode is removed to expose the pixel electrode.

3. The manufacturing method according to claim 1 , wherein during patterning the pixel electrode layer, the pixel electrode material layer is left in a source electrode forming region and a drain electrode forming region on the second insulating layer, so as to form the source electrode and the drain electrode on the pixel electrode material layer.

4. The manufacturing method according to claim 1 , wherein the source/drain metal layer is patterned with a first gray tone mask.

5. The manufacturing method according to claim 4 , wherein patterning with the first gray tone mask comprises the steps of:

forming a first photoresist layer on the source/drain metal layer;

exposing and developing the first photoresist layer with the first gray tone mask to form a first gray tone photoresist pattern, comprising a first full photoresist region that comprises a pixel electrode forming region, a first photoresist-free region that comprises a channel forming region, and a first partial photoresist region that comprises a source electrode forming region, a source forming region, a drain electrode forming region, and a drain forming region; and

etching the source/drain metal layer.

6. The manufacturing method according to claim 5 , further comprises:

processing the first gray tone photoresist pattern after etching the source/drain metal layer to completely remove the photoresist in the first partial photoresist region and reduce the thickness of the photoresist in the first full photoresist region;

depositing the passivation layer on the substrate, and lifting off the remaining first photoresist pattern to remove the passivation layer thereon; and

etching the exposed source/drain metal layer to expose the pixel electrode.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2015
From: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD
To: BOE TECHNOLOGY GROUP CO., LTD.; BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO. LTD
Reel/Frame 036644/0601 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2012
From: QIU, HAIJUN; WANG, ZHANGTAO; CHEN, XU; MIN, TAE YUP
To: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 028366/0252 →
Priority Claims (2)
CN 2006 1 0103865 · Aug 4, 2006 · national
CN 2006 1 0103866 · Aug 4, 2006 · national
Continuity (3)
Division 13069767 · Mar 23, 2011
Division 11834118 · Aug 6, 2007
Related Publication 20120034722A1 · Feb 9, 2012