Wiring board assembly and manufacturing method thereof
A wiring board assembly includes a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on the first main surface for surface contact with terminals of a chip and a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member. The reinforcing member has a plurality of structural pieces separated by slits extending from an inner circumferential surface to an outer circumferential surface of the reinforcing member.
1. A wiring board assembly, comprising:
a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on a chip mounting area of the first main surface for surface contact with terminals of a chip; and
a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member, the reinforcing member having a plurality of structural pieces separated by slits that extend from an inner circumferential surface to an outer circumferential surface of the reinforcing member and arranged on a circumferential area around the chip mounting area of the first surface so as to surround the connection terminals.
2. The wiring board assembly according to claim 1 , wherein the slits are nonlinear in shape.
3. The wiring board assembly according to claim 2 , wherein the slits are formed into a crank shape.
4. The wiring board assembly according to claim 1 , wherein the reinforcing member has a joint surface joined to the first main surface of the wiring board and a non-joint surface located opposite from the joint surface; and wherein the slits are smaller in width at the joint surface of the reinforcing member than at the non-joint surface of the reinforcing member.
5. The wiring board assembly according to claim 1 , wherein the conduction layers of the wiring board includes plain conduction layers located so as to correspond in position to the slits of the reinforcing member.
6. The wiring board assembly according to claim 1 , wherein the reinforcing member has a resin material filled in the slits to bond the structural pieces together by the resin material.
7. The wiring board assembly according to claim 6 , wherein the resin material of the reinforcing member is the same material as that of the resin insulation layers of the wiring board.
8. The wiring board assembly according to claim 6 , wherein the resin material of the reinforcing member is the same material as an underfill material filled in a clearance between the chip and the first main surface of the wiring board.
9. The wiring board assembly according to claim 6 , wherein the reinforcing member is fixed to the first main surface of the wiring board by an adhesive; and wherein the resin material of the reinforcing member is the same material as the adhesive.
10. The wiring board assembly according to claim 1 , wherein the structural pieces are placed in a frame-shaped arrangement such that the reinforcing member is kept from contact with the chip.
11. A wiring board assembly, comprising:
a rectangular plate-shaped wiring board having a plurality of resin insulation layers and conduction layers alternately laminated together to define opposite first and second main surfaces and a plurality of connection terminals arranged on a chip mounting area of the first main surface for surface contact with terminals of a chip; and
a rectangular frame-shaped reinforcing member fixed to the first main surface of the wiring board with the connection terminals exposed through an opening of the reinforcing member, the reinforcing member having a plurality of structural pieces separated by slits and a resin material filled in the slits to bond the structural pieces together by the resin material and arranged on a circumferential area around the chip mounting area of the first surface so as to surround the connection terminals.
12. The wiring board assembly according to claim 11 , wherein the slits extend from an inner circumferential surface to an outer circumferential surface of the reinforcing member.
13. The wiring board assembly according to claim 11 , wherein the reinforcing member has a joint surface joined to the first main surface of the wiring board and a non-joint surface located opposite from the joint surface; and wherein the slits are smaller in width at the joint surface of the reinforcing member than at the non-joint surface of the reinforcing member.
14. The wiring board assembly according to claim 11 , wherein the resin material of the reinforcing member is the same material as that of the resin insulation layers of the wiring board.
15. The wiring board assembly according to claim 11 , wherein the resin material of the reinforcing member is the same material as an underfill material filled in a clearance between the chip and the first main surface of the wiring board.
16. The wiring board assembly according to claim 11 , wherein the reinforcing member is fixed to the first main surface of the wiring board by an adhesive; and wherein the resin material of the reinforcing member is the same material as the adhesive.