Wiring board for light-emitting element
A wiring board for a light-emitting element includes a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, the conductor layer having a mounting region mounting a light-emitting element on one surface of the insulating substrate. The insulating substrate includes a heat-conducting pole-like conductor having a thermal conductivity higher than that of the insulating substrate. The heat-conducting pole-like conductor extends through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.
1. A light-emitting device, comprising:
a ceramic substrate having a hole therein;
a conducting block:
filling the hole and adhered to the ceramic substrate;
having a pole like shape; and
having a thermal conductivity higher than that of the ceramic substrate;
a first covering layer containing a metal, and covering a first end surface of the conducting block and a peripheral edge around the hole of the ceramic substrate;
a light-emitting element located above the first covering layer and the first end surface, and
a plurality of plated layers on the first covering layer, the plated layers comprising a nickel plated layer and a silver plated layer, wherein the nickel plated layer is located at a first covering layer side and the silver plated layer is located at a light emitting element side,
wherein the conducting block has a plane sectional area greater than that of the light-emitting element.
2. The light-emitting device according to claim 1 , wherein a width of the first end surface of the conducting block is wider than a width of the light-emitting element, and is narrower than a width of the first covering layer.
3. The light-emitting device according to claim 1 , further comprising a second covering layer covering a second end surface of the conducting block opposite to the first end surface and peripheral edge around the hole of the ceramic substrate.
4. The light-emitting device according to claim 1 , wherein the second covering layer contains a metal, ceramics, a resin or a mixture thereof.
5. The light-emitting device according to claim 1 , wherein the conducting block is comprises a composite material with a metal material and a ceramic material.
6. The light-emitting device according to claim 1 , wherein the conducting block is electrically coupled to a portion of an electric circuit.
7. The light-emitting device according to claim 1 , further comprising a frame on the ceramic substrate, surrounding the light-emitting element.
8. The light-emitting device according to claim 7 , wherein an inner diameter of the frame at a top end is larger than that at a bottom end, and the frame comprises an inner wall having a curved surface that is swelling toward the light-emitting element.