Method and apparatus for manufacturing multi-layered electro-optic devices
A method is provided for producing a hybrid multi junction photovoltaic device. The method begins by providing a plurality of planar photovoltaic semi-transparent modules. Each of the modules is a fully functional, thin-film, photovoltaic device and includes first and second conductive layers and at least first and second semiconductor layers disposed between the conductive layers. The first and second semiconductor layers define a junction at an interface therebetween. The method continues by disposing the modules one on top of another and hybridly adhering them to each other. At least one of the modules is configured to convert a first spectral portion of optical energy into an electrical voltage and transmit a second spectral portion of optical energy to another of the junctions that is configured to convert at least part of the second spectral portion of optical energy into an electrical voltage.
1. An apparatus for hybrid manufacturing of a multi-layered electro-optic device comprising:
a roll-to-roll system for feeding a plurality of electro-optic modules, at least one of the plurality of electro-optic modules being on a flexible substrate, each of the electo-optic modules including a fully functional, thin-film electro-optic device having first and second conductive layers and at least first and second semiconductor layers disposed between said conductive layers, said first and second semiconductor layers defining a junction at an interface therebetween;
an arrangement for monitoring and maintaining speed, tension and temperature of the modules as the modules traverse the roll-to-roll system;
at least one pressure roller to exert a compression force for attaching two of said modules on top of each other in a continuous fashion; and
an aligner system for positioning and laterally offsetting one of the modules over another of the modules.
2. The apparatus of claim 1 , wherein each module comprises a plurality of segmented modules and further comprising a view-vision system for selecting the module segments, separating and detaching the module segments from a carrier film, and removing remaining unused module segments.
3. An apparatus for hybrid manufacturing of a multi-layered electro-optic device comprising:
a pick and place system for handling a plurality of electro-optic modules, each of the electro-optic modules including a fully functional, thin-film electro-optic device having first and second conductive layers and at least first and second semiconductor layers disposed between said conductive layers, said first and second semiconductor layers defining a junction at an interface therebetween;
at least one pressure member to exert a compression force for attaching two of said modules on top of each other in an automated fashion; and
an aligner system for positioning and laterally offsetting one of the modules over another of the modules.
4. The apparatus of claim 3 , wherein each module comprises a plurality of segmented modules and further comprising a view-vision system for assisting an alignment process between segments of different modules.
5. A process for manufacturing a hybrid electro-optic device comprising:
feeding a plurality of electro-optic modules through a roll-to-roll system, at least one of the modules having a flexible substrate, each of the modules including a fully functional, thin-film electro-optic device having first and second conductive layers and at least first and second semiconductor layers disposed between said conductive layers, said first and second semiconductor layers defining a junction at an interface therebetween;
positioning and aligning one of the modules over another of the modules;
monitoring and maintaining speed, tension and temperature of said modules while being fed through the roll-to-roll system;
exerting a compression force for attaching two of said modules on top each other.
6. The process of claim 5 , further comprising a deposition of adhesive layers on at least one side of each of said modules.
7. The process of claim 5 , further comprising laminating said modules on top of each other.
8. The process of claim 5 , further comprising attaching a sacrificial flexible carrier to at least one of said modules.
9. The process of claim 5 , further comprising exposing a portion of said conducting layers of each module and providing an electrical connection from each of the conducting layers to an external circuit.
10. The process of claim 5 , wherein said modules are configured as panels and further comprising aligning and attaching said module panels on top of each other.