IP Library Granted Patent US 8,344,065
Granted Patent B2
US 8,344,065 · App. 12/717,952 · Granted Jan 1, 2013

Nanoimprint resist, nanoimprint mold and nanoimprint lithography

Assignees: Tsinghua University; Hon Hai Precision Industry Co., Ltd.
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Quick Facts
Patent No.
US 8,344,065
App. No.
12/717,952
Granted
Jan 1, 2013
Kind
B2
Abstract

A nanoimprint resist includes a hyperbranched polyurethane oligomer (HP), a perfluoropolyether (PFPE), a methylmethacrylate (MMA), and a diluent solvent. A method of a nanoimprint lithography is also provided.

Claims (10)

1. A nanoimprint resist comprising:

a hyperbranched polymer oligomer (HP), the HP is polymerized by a copolymerization of a trimellitic anhydride, an ethylene glycol, and an epoxy acrylic acid copolymer, or polymerized by a ring-opening copolymerization of an epoxy acrylic acid and an ethylene mercaptan;

a perfluoropolyether (PFPE);

a methylmethacrylate (MMA); and

a diluent solvent.

2. The nanoimprint resist of claim 1 , wherein a chemical structure HP is:

3. The nanoimprint resist of claim 1 , wherein the diluent solvent is 2-hydroxyethyl methacrylate or 2-Hydroxy Ethyl 2-methyl ethylene.

4. The nanoimprint resist of claim 1 , wherein a weight percent of the HP is in a range from about 50 wt % to about 60 wt %, a weight percent of the PFPE is in a range from about 3 wt % to about 5 wt %, a weight percent of the MMA is in a range from about 5 wt % to about 10 wt %, and a weight percent of the diluents solvent is in a range from about 25 wt % to about 35 wt %.

5. The nanoimprint resist of claim 4 , wherein the nanoimprint resist further comprises a polydimethlsiloxanes (PDMS) or methacrylatesilane with a weight percent in a range from about 5% to about 10%.

6. The nanoimprint resist of claim 4 , wherein the nanoimprint resist further comprises an initiator with a weight percent in a range from about 0.1% to about 2%.

Continuity (2)
Continuation 12712178 · Feb 24, 2010
Related Publication 20100308008A1 · Dec 9, 2010