Heterogeneous organic laminate stack ups for high frequency applications
Organic laminate stack ups are disclosed for a variety of applications, including high frequency RF applications. One or more inner core layers may be disposed between outer layers along with bondply or prepreg layers as needed. Discrete devices, including surface mount components and flip chips, may be embedded within the organic laminate stack up structures. The embedding of the discrete devices, which may be active or passive devices, may be in the form of a layer of bondply or prepreg encapsulating the discrete devices. In addition or in the alternative, cavities may be formed in at least the outer layers for housing discrete devices, which include surface mount components, flip chips, and wire bonded integrated circuits. A variety of caps may be utilized to seal the cavities. Further, shielding may be provided for the organic laminate stack up structure, including through a wall of vias or a plated trench cut along at least one side of the stack up structure. Each stack up structure may be packaged in a variety of ways, including as a surface mount component, ball grid array, or land grid array.
1. A multi-layer organic stack up, comprising:
a first organic layer;
a circuitized conductive layer on a surface of the first organic layer for forming passive circuits;
a second organic layer positioned opposite the circuitized conductive layer, wherein the second organic layer is coupled to the first organic layer with a layer of prepreg;
a top metal layer that acts as an outer surface of the multi-layer organic stack up;
a cavity defined by one or more walls formed by at least one of the second organic and the prepreg layer, wherein the cavity exposes at least a portion of the circuitized conductive layer;
a discrete device attached to the circuitized conductive layer in the cavity; and
a laminate cap attached to the top metal layer and substantially covering the cavity;
wherein the laminate cap is configured such that the cavity is not filled by the laminate cap; and
wherein at least one of the one or more walls of the cavity include metal shielding, and wherein the metal shielding is circuitized.
2. The multi-layer organic stack up of claim 1 , further comprising a metal layer substantially covering the laminate cap.
3. The multi-layer organic stack up of claim 2 , wherein the metal layer is circuitized.
4. The multi-layer organic stack up of claim 1 , wherein the discrete device is attached to the circuitized conductive layer at least in part by one of wire bond and solder.
5. The multi-layer organic stack up of claim 1 , further comprising a thermal conductor that provides thermal conductivity between the discrete device and the laminate cap.
6. A multi-layer organic stack up, comprising:
a first organic layer;
a circuitized conductive layer on a surface of the first organic layer for forming passive circuits;
a second organic layer positioned opposite the circuitized conductive layer, wherein the second organic layer is coupled to the first organic layer with a layer of prepreg;
a top metal layer that acts as an outer surface of the multi-layer organic stack up;
a cavity defined by one or more walls formed by at least one of the second organic and the prepreg layer, wherein the cavity exposes at least a portion of the circuitized conductive layer;
a discrete device attached to the circuitized conductive layer in the cavity; and
a laminate cap attached to the top metal layer and substantially covering the cavity;
wherein the laminate cap is configured such that the cavity is not filled by the laminate cap; and
further comprising a metal layer substantially covering the laminate cap; and
wherein the metal layer is circuitized;
wherein at least one of the one or more walls of the cavity include metal shielding, and wherein the metal shielding is circuitized; and
wherein the circuitized metal layer is conductively connected to the circuitized metal shielding.
7. The multi-layer organic stack up of claim 6 , wherein the circuitized metal shielding is conductively connected to the circuitized conductive layer.
8. A multi-layer organic stack up, comprising:
a first organic layer;
a circuitized conductive layer on a surface of the first organic layer for forming passive circuits;
a second organic layer positioned opposite the circuitized conductive layer, wherein the second organic layer is coupled to the first organic layer with a layer of prepreg;
a top metal layer that acts as an outer surface of the multi-layer organic stack up;
a cavity defined by one or more walls formed by at least one of the second organic and the prepreg layer, wherein the cavity exposes at least a portion of the circuitized conductive layer;
a discrete device attached to the circuitized conductive layer in the cavity; and
a molded plastic encapsulate attached to the top metal layer and substantially covering the cavity;
wherein the molded plastic encapsulate is configured such that the cavity is not filled by the molded plastic encapsulate; and
wherein at least one of the one or more walls of the cavity include metal shielding, and wherein the metal shielding is circuitized.