IP Library Granted Patent US 8,348,505
Granted Patent B2
US 8,348,505 · App. 12/971,738 · Granted Jan 8, 2013

Self-calibration circuit and method for junction temperature estimation

Assignee: NXP B.V.
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Quick Facts
Patent No.
US 8,348,505
App. No.
12/971,738
Granted
Jan 8, 2013
Kind
B2
Abstract

The present invention relates to a calibration circuit, computer program product, and method of calibrating a junction temperature measurement of a semiconductor element, wherein respective forward voltages at junctions of the semiconductor element and a reference temperature sensor are measured, and an absolute ambient temperature is determined by using the reference temperature sensor, and the junction temperature of the semiconductor element is predicted based on the absolute ambient temperature and the measured forward voltages.

Claims (23)

1. A method of determining a junction temperature of a semiconductor element, said method comprising:

within a calibration circuit, performing a calibration phase at at least two different ambient temperatures, the calibration phase comprising:

generating measurement currents and supplying them to the semiconductor element and to a reference temperature sensor which comprises a diode;

measuring the forward voltage at a junction of said semiconductor element and measuring the forward voltage at a junction of the reference temperature sensor; and

determining an absolute ambient temperature based on a proportional-to-absolute temperature measurement principle using voltage measurements from the semiconductor element and the reference temperature sensor; and

determining said junction temperature of said semiconductor element based on said absolute ambient temperatures and said measured forward voltages.

2. A method according to claim 1 , further comprising providing said calibration phase during an off-time of said semiconductor element.

3. A method according to claim 1 , further comprising arranging said reference temperature sensor at a place with substantially the same ambient temperature as said semiconductor element.

4. A method according to claim 3 , further comprising arranging said reference temperature sensor in a calibration circuit of said semiconductor element.

5. A method according to claim 1 , wherein said semiconductor element is a light emitting diode.

6. A circuit for determining a junction temperature of a semiconductor element, said circuit comprising a calibration circuit adapted to perform a calibration operation at at least two different ambient temperatures during a calibration phase, the calibration circuit comprising:

a reference temperature sensor comprising a diode;

a current source configured to generate measurement currents and to supply the measurement currents to the semiconductor element and to the reference temperature sensor;

a voltage measurement block configured to measure a forward voltage at a junction of said semiconductor element and to measure a forward voltage at a junction of said reference temperature sensor; and

a microcontroller or a microprocessor configured to derive an absolute ambient temperature based on a proportional-to-absolute temperature measurement principle using voltage measurements from the semiconductor element and from the reference temperature sensor;

wherein the determining circuit further comprises determining means for determining said junction temperature of said semiconductor element based on said absolute ambient temperatures and said measured forward voltages.

7. A circuit according to claim 6 , wherein said semiconductor element is a light emitting diode.

8. A computer program product comprising non-transitory computer readable code, which, when executed by a computing device, carries out the steps of claim 1 .

9. A light emitting diode (LED) driver integrated circuit (IC) for determining a junction temperature of an LED, said LED driver IC comprising a calibration circuit adapted to perform a calibration operation at at least two different ambient temperatures during a calibration phase, the calibration circuit comprising:

a reference temperature sensor comprising a diode;

a current source configured to generate measurement currents and to supply the measurement currents to the LED and to the reference temperature sensor;

a voltage measurement block configured to measure a forward voltage at a junction of said LED and to measure a forward voltage at a junction of said reference temperature sensor; and

a microcontroller or a microprocessor configured to derive an absolute ambient temperature based on a proportional-to-absolute temperature measurement principle using voltage measurements from the LED and from the reference temperature sensor and to determine the junction temperature of said LED based on said absolute ambient temperatures and said measured forward voltages.

Assignments (9)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Priority Claims (1)
EP 09179980 · Dec 18, 2009 · regional
Continuity (1)
Related Publication 20110150028A1 · Jun 23, 2011