Implanted metal silicide for semiconductor device
View Patent ↗A device and a method for forming a metal silicide is presented. A device, which includes a gate region, a source region, and a drain region, is formed on a substrate. A metal is disposed on the substrate, followed by a first anneal, forming a metal silicide on at least one of the gate region, the source region, and the drain region. The unreacted metal is removed from the substrate. The metal silicide is implanted with atoms. The implant is followed by a super anneal of the substrate.
1. A method of forming a metal silicide comprising:
forming a gate region, a source region, and a drain region in a substrate, wherein the forming the source region and the drain region further comprises forming one or more regions of dopants in the substrate;
disposing a metal on the substrate;
performing a silicide formation anneal to form a silicide on the gate region, the source region, and/or the drain region;
removing an unreacted metal from the substrate;
performing a post metal removal anneal after the removing the unreacted metal;
implanting a plurality of ions into the silicide after the performing the post metal removal anneal, the plurality of ions being neither N-type ions nor P-type ions and wherein the implanting the plurality of ions occurs with an energy of less than 1 KeV; and
performing a post implant anneal of the substrate, wherein the post implant anneal comprises a super anneal performed after the forming the source region and the drain region.
2. The method of claim 1 , wherein the metal disposed is selected from a group consisting of Ni, Co, Ti, a refractory metal, and alloys thereof.
3. The method of claim 1 , wherein the silicide formation anneal is a rapid thermal anneal (RTA).
4. The method of claim 3 , wherein the silicide formation anneal is performed at between about 200-300° C. for a duration of between about 15-60 seconds.
5. The method of claim 1 , wherein the super anneal is a flash anneal.
6. The method of claim 1 , wherein the super anneal is a laser anneal.
7. The method of claim 1 , wherein the plurality of ions are selected from a group consisting of Si, Ge, and compounds thereof.
8. The method of claim 1 , wherein the implanting is implemented before removing the unreacted metal.
9. The method of claim 1 , wherein the super anneal has a duration of between about 0.2 ms and 10 ms.
10. The method of claim 5 , wherein the super anneal has a temperature between about 950-1300° C.
11. A method of forming a metal silicide comprising:
forming a gate region, a source region, and a drain region in a substrate, wherein the forming the source region further comprises forming a region of dopants;
forming a silicide on the gate region, the source region, and the drain region;
implanting a plurality of ions into the silicide, the implanting the plurality of ions occurring with an energy of less than 1 KeV; and
performing a post implant anneal of the substrate, wherein the post implant anneal comprises a super anneal performed after the forming the source region, the super anneal imparting a stress value of about 1.0 GPa to the silicide.
12. The method of claim 11 , wherein the forming the silicide comprises forming a metal layer, performing a silicide anneal, and removing unreacted portions of the metal layer, and wherein the implanting the plurality of ions is performed after the performing the silicide anneal and prior to the removing of the unreacted portions of the metal layer.
13. The method of claim 11 , wherein the forming the silicide comprises forming a metal layer, performing a silicide anneal, and removing unreacted portions of the metal layer, and wherein the implanting the plurality of ions is performed after the removing of the unreacted portions of the metal layer.
14. The method of claim 11 , wherein the forming the silicide comprises forming a metal layer, performing a silicide anneal, removing unreacted portions of the metal layer, and performing a post metal removal anneal, and wherein the implanting the plurality of ions is performed after the post metal removal anneal.
15. The method of claim 11 , wherein the super anneal is a flash anneal.
16. The method of claim 11 , wherein the super anneal is a laser anneal.
17. The method of claim 11 , wherein the super anneal has a duration of between about 0.2 ms and 10 ms.
18. The method of claim 11 , wherein the super anneal has a temperature between about 950-1300° C.
19. The method of claim 11 , wherein the plurality of ions are selected from a group consisting of Si, Ge, and compounds thereof.