IP Library Granted Patent US 8,350,157
Granted Patent B2
US 8,350,157 · App. 12/870,999 · Granted Jan 8, 2013

Printed circuit board

Assignee: Hon Hai Precision Industry Co., Ltd.
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Quick Facts
Patent No.
US 8,350,157
App. No.
12/870,999
Granted
Jan 8, 2013
Kind
B2
Abstract

A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. An approximately C-shaped thermal engraving is defined in the surface of the layers, surrounding the through hole and without being covered by the layer of copper. An opening of the thermal engraving faces an output terminal of the power supply.

Claims (6)

1. A printed circuit board comprising a layer and a power supply, the layer comprising:

a layer of copper arranged on a surface of the layer;

wherein a through hole passes through the printed circuit board; and

wherein a C-shaped thermal engraving is defined in the surface of the layer and substantially surrounds the through hole, the C-shaped thermal engraving is not covered with the layer of copper, and an opening of the thermal engraving faces an output terminal of the power supply.

2. The printed circuit board of claim 1 , wherein a depth of the thermal engraving is greater than or equal to a thickness of the layer of copper.

3. The printed circuit board of claim 1 , wherein the layer is a power layer.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2018
From: HON HAI PRECISION INDUSTRY CO., LTD.
To: CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.
Reel/Frame 045281/0269 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2010
From: LAI, YING-TSO; PAI, YU-CHANG
To: HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 024904/0982 →
Priority Claims (1)
TW 99124454 A · Jul 23, 2010 · national
Continuity (1)
Related Publication 20120018199A1 · Jan 26, 2012