Laminated electronic component
A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 μm or less.
1. A laminated electronic component comprising:
an electronic component body including a plurality of laminated functional layers;
an internal conductor provided inside the electronic component body and including an exposed portion on an outer surface of the electronic component body; and
an external terminal electrode provided on the outer surface of the electronic component body and electrically connected to the internal conductor and arranged to cover the exposed portion of the internal conductor; wherein
the external terminal electrode includes a directly plated film that is directly plated on the outer surface of the electronic component body so as to cover the exposed portion of the internal conductor; and
an average grain diameter of metal grains defining the directly plated film is about 0.1 μm or less.
2. The laminated electronic component according to claim 1 , wherein the external terminal electrode further includes at least one upper layer plating film disposed on the directly plated film.
3. The laminated electronic component according to claim 1 , wherein the metal grains defining the directly plated film are Cu grains.