Semiconductor device and method of manufacturing the same
An FeRAM is produced by a method including the steps of forming a lower electrode layer ( 24 ), forming a first ferroelectric film ( 25 a ) on the lower electrode layer ( 24 ), forming on the first ferroelectric film ( 25 a ) a second ferroelectric film ( 25 b ) in an amorphous state containing iridium inside, thermally treating the second ferroelectric film ( 25 b ) in an oxidizing atmosphere to crystallize the second ferroelectric film ( 25 b ) and to cause iridium in the second ferroelectric film ( 25 b ) to diffuse into the first ferroelectric film ( 25 a ), forming an upper electrode layer ( 26 ) on the second ferroelectric film ( 25 b ), and processing each of the upper electrode layer ( 26 ), the second ferroelectric film ( 25 b ), the first ferroelectric film ( 25 a ), and the lower electrode layer ( 24 ) to form the capacitor structure. With such a structure, the inversion charge amount in a ferroelectric capacitor structure ( 30 ) is improved without increasing the leak current pointlessly, and a high yield can be assured, thereby realizing a highly reliable FeRAM.
1. A method of manufacturing a semiconductor device having a capacitor structure sandwiching a capacitor film constituted of a dielectric material by a lower electrode and an upper electrode above a semiconductor substrate, the method comprising, when forming the capacitor structure, the steps of:
forming a lower electrode layer;
forming a first dielectric film on the lower electrode layer;
forming on the first dielectric film a second dielectric film in an amorphous state containing iridium inside;
thermally treating the second dielectric film in an oxidizing atmosphere to crystallize the second dielectric film and to cause iridium in the second dielectric film to diffuse into the first dielectric film;
forming an upper electrode layer on the second dielectric film; and
processing each of the upper electrode layer, the second dielectric film, the first dielectric film, and the lower electrode layer to form the capacitor structure.
2. The method of manufacturing the semiconductor device according to claim 1 , wherein the first dielectric film is formed in an amorphous state, and the first dielectric film is crystallized together with the second dielectric film by the thermal treatment of the second dielectric film.
3. The method of manufacturing the semiconductor device according to claim 1 , wherein the first dielectric film is formed in an amorphous state, and
further comprising, before forming the second dielectric film, the step of thermally treating the first dielectric film in an oxidizing atmosphere to crystallize the first dielectric film.
4. The method of manufacturing the semiconductor device according to claim 1 , wherein the upper electrode layer is formed after the second dielectric film is formed, and the thermal treatment of the second dielectric film is performed in a state that the upper electrode layer is formed.
5. The method of manufacturing the semiconductor device according to claim 1 , wherein after the upper electrode layer is formed, the thermal treatment of the second dielectric film is performed again in a state that the upper electrode layer is formed.
6. The method of manufacturing the semiconductor device according to claim 1 , wherein the second dielectric film is constituted of a ferroelectric material having an ABO 3 -type perovskite structure containing iridium elements in at least one of A site and B site (A=at least one selected from bismuth, lead, barium, strontium, calcium, sodium, potassium, and rare-earth elements, and B=at least one selected from titanium, zirconium, niobium, tantalum, tungsten, manganese, iron, cobalt, chromium).
7. The method of manufacturing the semiconductor device according to claim 1 , wherein the second dielectric film is constituted of one selected from lead zirconate titanate, lead zirconate titanate doped with at least one selected from lanthanum, calcium, strontium, and silicon, lead lanthanum zirconate titanate, bismuth lanthanum titanate, strontium bismuth tantalate, and bismuth layered structure.
8. The method of manufacturing the semiconductor device according to claim 1 , wherein the first dielectric film is constituted of a ferroelectric material having an ABO 3 -type perovskite structure (A=at least one selected from bismuth, lead, barium, strontium, calcium, sodium, potassium, and rare-earth elements, and B=at least one selected from titanium, zirconium, niobium, tantalum, tungsten, manganese, iron, cobalt, chromium).
9. The method of manufacturing the semiconductor device according to claim 1 , wherein the first dielectric film is constituted of one selected from lead zirconate titanate, lead zirconate titanate doped with at least one selected from lanthanum, calcium, strontium, and silicon, lead lanthanum zirconate titanate, bismuth lanthanum titanate, strontium bismuth tantalate, and bismuth layered structure.