IP Library Granted Patent US 8,362,533
Granted Patent B2
US 8,362,533 · App. 12/869,502 · Granted Jan 29, 2013

Semiconductor device including a transistor and a ferroelectric capacitor

Inventor: Tohru Ozaki (Shinagawa-ku, JP)
Assignee: Kabushiki Kaisha Toshiba
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Quick Facts
Patent No.
US 8,362,533
App. No.
12/869,502
Granted
Jan 29, 2013
Kind
B2
Abstract

According to an aspect of the present invention, there is provided a semiconductor device including: a transistor including: a source, a drain and a gate; first and second plugs on the source and the drain; a third plug on the gate to have a top face higher than that of the first plug; an interlayer insulating film covering the transistor and the first to the third plugs; a ferroelectric capacitor on the interlayer insulating film, one electrode thereof being connected to the first plug; a barrier film covering surfaces of the ferroelectric capacitor and the interlayer insulating film to prevent a substance affecting the ferroelectric capacitor from entering therethrough; and fourth and fifth plugs disposed on the second and the third plugs and connected thereto through connection holes formed in the barrier film.

Claims (36)

1. A semiconductor device comprising:

a transistor including:

a first main electrode,

a second main electrode, and

a control electrode;

a first plug that is disposed on the first main electrode;

a second plug that is disposed on the second main electrode;

a third plug that is disposed on the control electrode;

an interlayer insulating film that is disposed to cover the transistor, the first plug, the second plug and the third plug;

a ferroelectric capacitor including:

a first electrode that is disposed on the interlayer insulating film and is electrically connected to the first plug,

a second electrode that is separated from the first electrode, and

a ferroelectric film that is disposed between the first electrode and the second electrode;

a barrier film that covers a surface of the ferroelectric capacitor and a surface of the interlayer insulating film and prevents a substance affecting a crystalline composition or a polarization characteristic of a ferroelectric from entering therethrough;

a fourth plug that is disposed on the second plug and is electrically connected to the second plug through a first connection hole disposed in the barrier film;

an eleventh plug that is disposed on the third plug below the barrier film;

a fifth plug that is disposed on the eleventh plug and is electrically connected to the eleventh plug through a second connection hole disposed in the barrier film; and

wherein a bottom face area of the eleventh plug is larger than a top face area of the third plug.

2. A semiconductor device comprising:

a transistor including:

a first main electrode,

a second main electrode, and

a control electrode;

a first plug that is disposed on the first main electrode;

a second plug that is disposed on the second main electrode;

a third plug that is disposed on the control electrode;

an interlayer insulating film that is disposed to cover the transistor, the first plug, the second plug and the third plug;

a ferroelectric capacitor including:

a first electrode that is disposed on the interlayer insulating film and is electrically connected to the first plug,

a second electrode that is separated from the first electrode, and

a ferroelectric film that is disposed between the first electrode and the second electrode;

a barrier film that covers a surface of the ferroelectric capacitor and a surface of the interlayer insulating film and prevents a substance affecting a crystalline composition or a polarization characteristic of a ferroelectric from entering therethrough;

a fourth plug that is disposed on the second plug and is electrically connected to the second plug through a first connection hole disposed in the barrier film;

an eleventh plug that is disposed on the third plug below the barrier film;

a fifth plug that is disposed on the eleventh plug and is electrically connected to the eleventh plug through a second connection hole disposed in the barrier film; and

wherein a bottom face area of the eleventh plug is larger by an alignment allowance dimension than a top face area of the third plug.

Priority Claims (2)
JP 2007-118908 · Apr 27, 2007 · national
JP 2007-141292 · May 29, 2007 · national
Continuity (2)
Division 12109817 · Apr 25, 2008
Related Publication 20100320518A1 · Dec 23, 2010