Flexible circuit light-emitting structures
Light-emitting structures, and related components, systems, and methods associated therewith are provided. In one embodiment, a light-emitting structure includes at least one LED, a contact bond pad supported by the at least one LED, and a flexible circuit member bonded to the contact bond pad.
1. A light-emitting structure, comprising:
at least one LED;
a contact bond pad supported by a top surface of the at least one LED, the top surface including at least one portion through which light is emitted; and
a flexible circuit member bonded to the contact bond pad, wherein the light-emitting structure is free of wire bonds.
2. The light-emitting structure of claim 1 , wherein the flexible circuit member is bonded via one or more bump bonds, a solder bond, a thermosonic bond, an epoxy bond or a wedge bond.
3. The light-emitting structure of claim 1 , further comprising a support structure configured to support the at least one LED.
4. The light-emitting structure of claim 3 , wherein the support structure is further configured to support at least a portion of the flexible circuit member.
5. The light-emitting structure of claim 3 , wherein the support structure comprises a substantially thermally conductive support structure.
6. The light-emitting structure of claim 5 , wherein the substantially thermally conductive support structure comprises copper or aluminum.
7. The light-emitting structure of claim 1 , wherein the flexible circuit member comprises at least one metallic layer and at least one dielectric layer.
8. The light-emitting structure of claim 1 , wherein the flexible circuit member comprises at least one dielectric layer disposed between a plurality of metallic layers.
9. The light-emitting structure of claim 8 , wherein at least one of the plurality of metallic layers is associated with an electrical p-contact member.
10. The light-emitting structure of claim 8 , wherein at least one of the plurality of metallic layers is associated with an electrical n-contact member.
11. The light-emitting structure of claim 1 , wherein the light-emitting structure further comprises an optical member.
12. The light-emitting structure of claim 11 , wherein the optical member is less than about 200 microns away from a top surface of the LED.
13. The light-emitting structure of claim 11 , wherein the optical member is in direct contact with a top surface of the LED.
14. The light-emitting structure of claim 11 , wherein the optical member is a non-imaging collection optical member.
15. The light-emitting structure of claim 13 , wherein a substantial portion of the optical member has an index of refraction less than about 1.4.
16. The light-emitting structure of claim 1 , wherein the at least one LED comprises a dielectric function that varies spatially according to a pattern.
17. The light-emitting structure of claim 1 , wherein the at least one LED has a surface area greater than about 1 mm 2 .
18. A light-emitting structure, comprising:
a support structure;
a flexible circuit member;
at least one LED supported by the support structure and attached to the flexible circuit member via a top surface of the at least one LED, the top surface including at least one portion through which light is emitted,
wherein the light-emitting structure is free of wire bonds.
19. The light-emitting structure of claim 18 , further comprising at least one contact bond pad in contact with at least one LED and bonded to the flexible circuit member, wherein the at least one contact bond pad is affixed to a top surface of the at least one LED.