Anisotropic wetting behavior on one-dimensional patterned surfaces for applications to microfluidic devices
In accordance with the invention, there are surfaces exhibiting anisotropic wetting, microfluidic devices and microreactors including the surfaces and methods of controlling anisotropic wetting behavior of the surfaces. The exemplary surface can include a substrate and a plurality of rectangular shaped structures arranged to form a macroscopic pattern over the substrate, wherein the plurality of rectangular shaped structures delineate a top surface of the rectangular structures from a surface of the substrate, the rectangular shaped structures including substantially vertical walls having a height of about 100 nm to about 10 μm and wherein the shape of the macroscopic pattern, the height of the substantially vertical walls, and a surface chemistry of the top surface controls anisotropic wetting at the top surface of the rectangular structures.
1. A surface comprising:
a substrate;
a plurality of rectangular shaped structures arranged to form a macroscopic pattern over the substrate; and
a hydrophobic region surrounding a periphery of the macroscopic pattern configured to direct a fluid to the macroscopic pattern,
wherein the plurality of rectangular shaped structures delineate a top surface of the macroscopic pattern from a surface of the substrate, each of the plurality of rectangular shaped structures comprising substantially vertical walls having a height of about 100 nm to about 10 μm; and
wherein a shape of the macroscopic pattern, the height of the substantially vertical walls, and a surface chemistry of the top surface controls anisotropic wetting on the top of the rectangular structures.
2. The surface of claim 1 , wherein the pattern further comprises surface treatment to tune the anisotropic wetting selected from the group consisting of a hydrophobic, an ultra-hydrophobic, a super-hydrophobic, a hydrophilic, and a super-hydrophilic surface.
3. The surface of claim 2 , wherein the surface treatment comprises a thin layer of nanoparticles disposed over the pattern.
4. The surface of claim 3 , wherein the surface treatment comprises a thin layer of silica nanoparticles disposed over the pattern.
5. The surface of claim 3 , wherein the surface treatment comprises a thin layer of functionalized nanoparticles disposed over the pattern, wherein the nanoparticles are functionalized for one or more of photonics, catalysis, chemical/biological sensing, separation, bio-mimic structure, and nanofluidic applications.
6. The surface of claim 2 , wherein the surface treatment comprises plasma treatment of the pattern with one or more gases selected from the group consisting of oxygen, CF 4 , and CHF 3 , CH 2 F 2 , CH 3 F, and other related carbon-hydride-halide species.
7. The surface of claim 1 , wherein one or more rectangular shaped structures is arranged in one or more ways selected from the group consisting of straight, circular, square, and serpentine.
8. The surface of claim 1 , wherein the plurality of rectangular shaped structures are arranged to form a plurality of patterns, wherein the plurality of patterns are arranged in one of the ways selected from the group consisting of parallel, at an angle, serpentine, and perpendicular.
9. A microfluidic device comprising the surface of claim 1 .
10. A microreactor comprising the surface of claim 1 .
11. A lab-on-a-chip system comprising the surface of claim 1 .
12. A method for using a pattern to control fluid flow, the method comprising:
depositing a photosensitive film stack over a substrate;
forming a macroscopic pattern on the film stack, the macroscopic pattern comprising a plurality of rectangular shaped structures, wherein the plurality of rectangular shaped structures delineate a top surface of the macroscopic pattern from a surface of the substrate, each of the plurality of rectangular shaped structures comprising substantially vertical walls having a height of about 100 nm to about 10 μm and wherein the shape of the macroscopic pattern, the height of the substantially vertical walls, and a surface chemistry of the top surface controls anisotropic wetting at the top surface of the rectangular structures;
delimiting the macroscopic pattern comprising the plurality of rectangular shaped structures, wherein a periphery of the macroscopic pattern is surrounded by a hydrophobic region to direct a fluid to the macroscopic pattern; and
tuning the anisotropic wetting at the top surface of the rectangular structures to guide the fluid flow on top of the pattern, wherein the fluid flow is controlled using one or more of gravity, electric field, and magnetic field.
13. The method for using a pattern to control fluid flow according to claim 12 , wherein the step of forming a pattern on the film stack comprises forming a pattern using a technique selected from the group consisting of photolithography, nanoimprint lithography, interferometric lithography, e-beam lithography, ion-beam lithography, strained micro-wrinkling, and embossing.
14. The method for using a pattern to control fluid flow according to claim 12 , wherein the step of forming a pattern on the film stack comprises forming a plurality of rectangular shaped structures, such that one or more rectangular shaped structures is arranged in one or more ways selected from the group consisting of straight, circular, square, and serpentine.
15. The method for using a pattern to control fluid flow according to claim 12 , wherein the step of forming a pattern on the film stack comprises forming a plurality of patterns, each of the plurality of patterns comprising a plurality of rectangular shaped structures, wherein the plurality of patterns are arranged in one of the ways selected from the group consisting of parallel, at an angle, serpentine, and perpendicular.
16. The method for using a pattern to control fluid flow according to claim 12 , wherein the step of tuning the anisotropic wetting at the top surface of the rectangular structures to control the fluid flow on top of the pattern comprises forming a thin layer of nanoparticles over the pattern.
17. The method for using a pattern to control fluid flow according to claim 16 , wherein the step of forming a thin layer of nanoparticles over the pattern comprises forming a thin layer of silica nanoparticles over the pattern.
18. The method for using a pattern to control fluid flow according to claim 16 further comprising modifying surface of nanoparticles to provide additional functionality, wherein the surface of nanoparticles is functionalized for one or more of photonics, catalysis, chemical/biological sensing, separation, bio-mimic structure, and nanofluidic applications.
19. The method for using a pattern to control fluid flow according to claim 12 , wherein the step of tuning the anisotropic wetting at the top surface of the rectangular structures to control the fluid flow on top of the pattern comprises using plasma treatment of the pattern with one or more gases selected from the group consisting of oxygen, CF 4 , and CHF 3 , CH 2 F 2 , CH 3 F, and other related carbon-hydride-halide species.
20. The method for using a pattern to control fluid flow according to claim 12 further comprises transferring the pattern from the film stack onto the substrate.
21. A method of confining liquid in limited area structures, the method comprising:
depositing a photosensitive film stack over a substrate;
forming a pattern on the film stack, the pattern comprising a plurality of rectangular shaped structures, wherein the plurality of rectangular shaped structures delineate a top surface of the pattern from a surface of the substrate, each of the plurality of rectangular shaped structures comprising substantially vertical walls having a height of about 100 nm to about 10 μm and wherein a shape of the macroscopic pattern, the height of the substantially vertical walls, and a surface chemistry of the top surface controls anisotropic wetting at the top surface of the rectangular structures;
delimiting the pattern comprising the plurality of rectangular shaped structures, wherein a periphery of the pattern is surrounded by a hydrophobic region to direct a fluid to the pattern; and
tuning the anisotropic wetting at the top surface of the rectangular structures to guide the fluid flow on top of the pattern; and
immersing and removing the substrate in a liquid bath, wherein upon removal the liquid is confined only to the pattern.
22. The method of guiding liquid in limited area structures according to claim 21 , wherein the step of tuning the anisotropic wetting at the top surface of the rectangular structures comprises forming a thin layer of nanoparticles over the pattern.
23. The method of guiding liquid in limited area structures according to claim 21 , wherein the step of tuning the anisotropic wetting at the top surface of the rectangular structures to control the fluid flow on top of the pattern comprises using plasma treatment of the pattern with one or more gases selected from the group consisting of oxygen, CF 4 , and CHF 3 , CH 2 F 2 , CH 3 F, and other related carbon-hydride-halide species.
24. A method of segregating particles comprising:
providing an anisotropic hydrophobic surface comprising a pattern, a periphery of the pattern surrounded by a hydrophobic region to direct a fluid to the pattern, the pattern comprising a plurality of rectangular shaped structures, wherein the plurality of rectangular shaped structures delineate a top surface of the pattern from a surface of the substrate, each of the plurality of rectangular shaped structures comprising substantially vertical walls having a height of about 100 nm to about 10 μm and wherein the shape of the macroscopic pattern, the height of the substantially vertical walls, and a surface chemistry of the top surface controls anisotropic wetting at the top surface of the rectangular structures;
providing a liquid comprising colloidal particles over the anisotropic hydrophobic surface, such that the liquid spreads out widely with a low vertical height and enlarged contact lines with two circular ends; and
evaporating the liquid over the anisotropic hydrophobic surface, wherein the liquid evaporates with an initial decrease of the contact angle with only a small change of the contact line, such that a wide band of particles can be deposited at the two circular ends and narrow band along the contact line connecting the two circular ends.