System-in-package platform for electronic-microfluidic devices
An integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate on a first support, an electronic circuit on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. A micro fluidic structure is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away from the first support.
1. An integrated electronic-microfluidic device, comprising
a semiconductor substrate on a first support;
an electronic circuit on a first semiconductor-substrate side of the semiconductor substrate;
a signal interface structure to an external device, the signal interface structure being arranged on the first semiconductor-substrate side and configured to receive electrical signals from the electronic circuit; and
a microfluidic structure formed in the semiconductor substrate, the microfluidic structure being configured to confine a fluid to a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away from the first support and to allow a flow of the fluid to and from the microfluidic structure only on the second semiconductor-substrate side.
2. The integrated electronic-microfluidic device of claim 1 , further comprising a second support on the second semiconductor-substrate side, the second support having an opening that allows a flow of the fluid to and from the microfluidic structure.
3. The integrated electronic-microfluidic device of claim 2 , wherein the signal interface structure comprises at least one T-shaped internal-contact element, with a substrate section corresponding to the vertical T-bar that is arranged on the semiconductor substrate and is connected to the electronic circuit, and with a side-face section corresponding to the horizontal T-bar that is arranged on an inclined side face of the substrate and forms an electrically isolated lead connecting to external-contact elements on an outer face of the first support, the external-contact elements being configured to establish an electrical contact to an external device.
4. The integrated electronic-microfluidic device of claim 3 , wherein the side-face section of the T-shaped internal-contact element is arranged abutting the semiconductor substrate, and wherein a the semiconductor substrate comprises a first electrical-isolation trench that is arranged and configured to isolate the side-face section Of the T-shaped internal-contact element on one side of the first electrical-isolation trench from semiconductor substrate portions on the opposite side of the first electrical-isolation trench.
5. The integrated electronic-microfluidic device of claim 1 , wherein either only the first support or the first and second supports are thermally insulating, and wherein the microfluidic structure is surrounded by a first thermal-isolation trench in the semiconductor substrate that is open to the second semiconductor substrate side and is filled with a thermally insulating material or is at least partially empty.
6. The integrated electronic-microfluidic device of claim 5 , wherein the first thermal-isolation trench extends from the second semiconductor-substrate side through the semiconductor substrate and is covered on the first semiconductor-substrate side by a thermally insulating layer, which is arranged on the semiconductor substrate.
7. The integrated electronic-microfluidic device of claim 1 , wherein the microfluidic structure comprises a reaction chamber formed by a first recess in the semiconductor substrate and confined by a recess wall, and a second thermal-isolation trench surrounding the recess wall.
8. The integrated electronic-microfluidic device of claim 1 , wherein the microfluidic structure comprises an electrophoretic pump with a second recess in the semiconductor substrate and two field plates, which are formed by recess walls, which are electrically isolated from the semiconductor substrate by an adjacent second electrical-isolation trench.
9. The integrated electronic-microfluidic device of claim 1 , wherein the electronic circuit comprises a photodiode that is arranged immediately adjacent to a microfluidic structure in the form of a microfluidic channel in the semiconductor substrate.
10. The integrated electronic-microfluidic device of claim 1 , wherein the electronic circuit comprises two contact elements on the first semiconductor substrate side that extend to a microfluidic structure in the form of a third recess in the semiconductor substrate and are configured to establish a direct galvanic contact to a fluid in the third recess.
11. The integrated electronic-microfluidic device of claim 2 , wherein an adhesive layer of Benzocyclobutene, BCB, is arranged between the second support and the semiconductor substrate.
12. The integrated electronic-microfluidic device of claim 1 , wherein the opening in the second support is configured to hold a removable lid.
13. The integrated electronic-microfluidic device of claim 12 , comprising a removable lid arranged in the opening.
14. The integrated electronic-microfluidic device of claim 2 , wherein the first and second supports are glass plates.
15. The integrated electronic-microfluidic device of claim 2 , wherein the first or second support is made from a polymer.
16. The integrated electronic-microfluidic device of claim 1 , wherein the signal-interface structure comprises an antenna that is configured to transmit and receive electromagnetic signals in the radio frequency spectrum.