Composite containing polymer, filler and metal plating catalyst, method of making same, and article manufactured therefrom
Disclosed herein is a component comprising a substantially homogeneous composition of at least one polymer selected from the group consisting of epoxies, acetals, polyesters, non-ionic rubbers, non-ionic polyurethanes, polyether sulfones, polyether ether ketones, polyether imides, polystyrenes, polyethylene terephthalates, polyamides, polyimides, polyvinylchlorides, polyphenylene oxides, polycarbonates, acrylonitrile-butadiene-styrene terpolymers, silicones, fluropolymers, and polyolefins, a filler, and a metal plating catalyst. A method of making a component also is described comprising obtaining a polymeric material, a liquid, a filler and a metal plating catalyst; combining the metal plating catalyst with the polymeric material, liquid, and filler to form a substantially homogeneous mixture; and evaporating and/or curing the mixture to form a solidified component. The method is useful for making small, precisely engineered, electronic components without requiring the use of caustic solutions or complex equipment.
1. A component comprising:
a substantially homogeneous composition of:
at least one polymer selected from the group consisting of epoxies, acetals, polyesters, non-ionic polyurethanes, polyether sulfones, polyether ether ketones, polyether imides, polyethylene terephthalates, polyamides, polyimides, polyvinylchlorides, polyphenylene oxides, polycarbonates, silicones, fluropolymers, and polyolefins,
a filler comprising at least one member selected from the group consisting of synthetic fibers, natural fibers, glass fibers, glass filaments, metal fibers, metal filaments, natural filaments and synthetic filaments, and
a metal plating catalyst comprising a metal.
2. The component of claim 1 , wherein the filler is present in an amount of at least 1 part by weight based upon 100 parts by weight of polymer and filler.
3. The component of claim 1 , wherein the filler is present in an amount of at least 50 parts by weight based upon 100 parts by weight of polymer and filler.
4. The component of claim 1 , wherein the filler comprises at least one member selected from the group consisting of carbon fibers, carbon filaments, carbon nanotube fibers and carbon nanotube filaments.
5. The component of claim 1 , wherein the metal plating catalyst contains Pd in an amount of about 100 to about 1500 ppm.
6. The component of claim 1 , wherein the polymer is a thermoset.
7. The component of claim 1 , wherein the metal plating catalyst comprises at least one member selected from the group consisting of Pd, Pt, Ni, Co, Cu, Ag, Rh, Ir, Au and blends, alloys, and compounds thereof.
8. The component of claim 1 , wherein the polymer comprises an epoxy and the filler comprises at least one member selected from the group consisting of carbon fibers, carbon filaments, carbon nanotube fibers, carbon nanotube filaments, and fiberglass fibers.
9. A component comprising:
a substrate having a plated metal layer formed thereon, the substrate comprising a substantially homogeneous composition of:
at least one polymer selected from the group consisting of epoxies, acetals, polyesters, non-ionic polyurethanes, polyether sulfones, polyether ether ketones, polyether imides, polyethylene terephthalates, polyamides, polyimides, polyvinylchlorides, polyphenylene oxides, polycarbonates, silicones, fluropolymers, and polyolefins,
a filler comprising at least one member selected from the group consisting of synthetic fibers, natural fibers, glass fibers, glass filaments, metal fibers, metal filaments, natural filaments and synthetic filaments, and
a metal plating catalyst comprising a metal.
10. The component of claim 9 , wherein the metal plating catalyst comprises at least one member selected from the group consisting of Pd, Pt, Ni, Co, Cu, Ag, Rh, Ir, Au and blends, alloys, and compounds thereof.
11. The component of claim 9 , wherein the plated metal layer comprises at least one member selected from the group consisting of Au, Ag, Sn, Cr, Cu, Ni, Zn, Be, Pt, Pd, Ti, Mo, and Mn, and blends, alloys and compounds thereof.
12. The component of claim 9 , wherein the adhesion strength between the plated metal layer and the substrate is greater than the cohesive strength of the substrate.
13. The component of claim 9 , wherein the polymer comprises an epoxy and the filler comprises at least one member selected from the group consisting of carbon fibers, carbon filaments, carbon nanotube fibers, carbon nanotube filaments, and fiberglass fibers.
14. A component comprising:
a substantially homogeneous composition of:
at least one polymer selected from the group consisting of epoxies, acetals, polyesters, non-ionic polyurethanes, polyether sulfones, polyether ether ketones, polyether imides, polyethylene terephthalates, polyamides, polyimides, polyvinylchlorides, polyphenylene oxides, polycarbonates, silicones, fluropolymers, and polyolefins,
a filler comprising at least one member selected from the group consisting of synthetic fibers, natural fibers, glass fibers, glass filaments, metal fibers, metal filaments, natural filaments, and synthetic filaments, and
a metal plating catalyst present in an amount of about 0.01 to about 5000 ppm, the catalyst comprising a metal.
15. The component of claim 14 , wherein the filler is present in an amount of at least 50 parts by weight based upon 100 parts by weight of polymer and filler.
16. The component of claim 14 , wherein the filler comprises at least one member selected from the group consisting of carbon fibers, carbon filaments, carbon nanotube fibers and carbon nanotube filaments.
17. The component of claim 14 , wherein the polymer comprises an epoxy.
18. The component of claim 14 , wherein the metal plating catalyst includes Pd, the Pd being present in an amount of about 100 to about 1500 ppm.
19. The component of claim 16 , wherein the metal plating catalyst includes Pd, the Pd being present in an amount of about 100 to about 1500 ppm.
20. The component of claim 14 , wherein the polymer is a thermoset.
21. The component of claim 15 , wherein the polymer is a thermoset.
22. The component of claim 14 , wherein the metal plating catalyst comprises at least one member selected from the group consisting of Pd, Pt, Ni, Co, Cu, Ag, Rh, Ir, Au and blends, alloys, and compounds thereof.
23. The component of claim 14 , wherein the polymer comprises an epoxy and the filler comprises at least one member selected from the group consisting of carbon fibers, carbon filaments, carbon nanotube fibers, carbon nanotube filaments, and fiberglass fibers.
24. The component of claim 14 , wherein the filler comprises at least one member selected from the group consisting of synthetic fibers, natural fibers, glass fibers, glass filaments, metal fibers, metal filaments, natural filaments, and synthetic filaments, the metal plating catalyst comprises at least one member selected from the group consisting of Pd, Pt, Ni, Co, Cu, Ag, Rh, Ir, Au and blends, alloys, and compounds thereof, and the polymer is a thermoset.
25. The component of claim 24 , wherein the metal plating catalyst includes Pd, the Pd being present in an amount of about 100 to about 1500 ppm.