IP Library Granted Patent US 8,395,504
Granted Patent B2
US 8,395,504 · App. 12/227,285 · Granted Mar 12, 2013

IC label for prevention of forgery

Inventors: Kozue Furuichi (Kasukabe, JP); Toru Endo (Kasukabe, JP); Manabu Suzuki (Hasuda, JP); Hidehiko Kando (Matsudo, JP)
Assignees: Toppan Printing Co., Ltd.; Hitachi, Ltd.
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Quick Facts
Patent No.
US 8,395,504
App. No.
12/227,285
Granted
Mar 12, 2013
Kind
B2
Abstract

An IC label for prevention of forgery includes: a label substrate which has an adhesive agent for affixing the same to an object; a non-contact IC medium which is provided on the label substrate and has an IC chip for storing predetermined identification information and an antenna for wireless transmission of the identification information; and a security function portion which is provided on the label substrate and prevents replication.

Claims (26)

1. An IC label for prevention of forgery comprising:

a label substrate which has an adhesive agent for affixing the same to an object;

a non-contact IC medium which is provided on the label substrate and has an IC chip for storing predetermined identification information and an antenna for wireless transmission of the identification information; and

a security function portion which is provided on the label substrate so as to be adjacent to the antenna in a width direction of the antenna, the security function portion being greater than the antenna in size in the width direction of the antenna, wherein

a cut-out is formed in the label substrate so as not to reach a periphery of the label substrate,

a cut-out is formed in the non-contact IC medium, and

at least a part of the cut-out formed in the label substrate is continuous with the cut-out formed in the non-contact IC medium in planar view.

2. The IC label for prevention of forgery according to claim 1 , wherein the label substrate is formed of a breakable material.

3. The IC label for prevention of forgery according to claim 1 , wherein the label substrate includes a solvent detection portion which is dissolved by a peeling solvent for peeling the label substrate affixed to the object, or reacts chemically with the peeling solvent.

4. The IC label for prevention of forgery according to claim 1 , wherein the label substrate includes a heat detection portion which undergoes color change when heated or reacts chemically by the effect of heat.

5. The IC label for prevention of forgery according to claim 1 , wherein the identification information is intrinsic identification information for each IC chip.

6. The IC label for prevention of forgery according to claim 1 , wherein the identification information is correlated with management information for management of the object.

7. The IC label for prevention of forgery according to claim 1 , wherein:

the IC chip includes a read-only memory; and

the identification information is stored in the read-only memory.

8. The IC label for prevention of forgery according to claim 1 , wherein the security function portion includes at least one of:

an OVD functional material which undergoes color change depending on an angle of light incident on the security function portion or an angle of visual recognition of the security function portion;

a fluorescent material or a phosphorescent material excited by electromagnetic waves of a specified wavelength to emit electromagnetic waves of a wavelength different from that of the specified wavelength; and

a liquid crystal material which has polarizability of a specific pattern and displays the pattern by taking out specifically polarized light.

9. The IC label for prevention of forgery according to claim 1 , wherein:

the label substrate includes an optical identification portion which has optically readable optical identification information; and

the identification information and the optical identification information are at least partly correlated with each other.

10. The IC label for prevention of forgery according to claim 9 , wherein the security function portion and the optical identification portion are provided on the same surface of the label substrate.

11. The IC label for prevention of forgery according to claim 1 , wherein the label substrate is formed of a breakable material of which any one of the tensile strength, breaking strength, and tearing strength is equal to or less than the adhesion strength of the adhesive agent.

12. The IC label for prevention of forgery according to claim 1 , wherein the adhesive agent is arranged between the label substrate and the non-contact IC medium so that the label substrate is capable of being affixed to the object with the non-contact IC medium being not adhered to the object.

13. The IC label for prevention of forgery according to claim 1 , wherein the cut-out formed in the non-contact IC medium reaches the antenna.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2015
From: HITACHI, LTD.
To: TOPPAN PRINTING CO., LTD.
Reel/Frame 035862/0004 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2009
From: FURUICHI, KOZUE; ENDO, TORU; SUZUKI, MANABU; KANDO, HIDEHIKO
To: TOPPAN PRINTING CO., LTD.; HITACHI, LTD.
Reel/Frame 023080/0841 →
Priority Claims (1)
JP P2006-136284 · May 16, 2006 · national
Continuity (1)
Related Publication 20090303044A1 · Dec 10, 2009