Methods, apparatus and articles of manufacture to diagnose temperature-induced memory errors

1. A method to diagnose a temperature-induced memory error, the method comprising:

storing a queue of measured temperatures associated with a memory device;

detecting a memory error associated with the memory device; and

writing, in the memory device when the memory error is detected, a highest measured temperature of the memory device selected from the queue.

2. A method as defined in claim 1 , further comprising comparing the highest measured temperature written in the memory device with a maximum specified operating temperature of the memory device to determine whether the memory error comprises a temperature-induced memory error.

3. A method as defined in claim 1 , wherein the memory device comprises a dual in-line memory module (DIMM) and the temperature is written in a serial presence detect (SPD) byte of the DIMM.

4. A method as defined in claim 1 , wherein the highest measured temperature and an identifier corresponding to the memory device are further written in an event log.

5. A method as defined in claim 1 , further comprising:

performing a functional test of the memory device;

when the memory device passes the functional test, obtaining the highest measured temperature from the memory device;

comparing the highest measured temperature to a maximum specified operating temperature of the memory device; and

when the highest measured temperature exceeds the maximum specified operating temperature of the memory device, identifying the memory device as operating correctly.

6. A tangible article of manufacture storing machine-readable instructions that, if executed by a machine, cause the machine to:

store a queue of measured temperatures associated with a memory device;

receive an indication of a memory error associated with the memory device; and

write, in the memory device when the indication is received, a highest measured temperature of the memory device selected from the queue.

7. A tangible article of manufacture as defined in claim 6 , wherein the machine-readable instructions, if executed by the machine, cause the machine to write the highest measured temperature and an identifier corresponding to the memory device in an event log.

8. A tangible article of manufacture as defined in claim 7 , wherein the machine-readable instructions, if executed by the machine, cause the machine to write a plurality of temperatures of the memory device preceding the memory error in the event log.

9. A tangible article of manufacture as defined in claim 6 , wherein memory device comprises a dual in-line memory module (DIMM), and the machine-readable instructions, if executed by the machine, cause the machine to write the highest measured temperature in a serial presence detect (SPD) byte of the DIMM.

10. An apparatus to diagnose a temperature-induced memory error, the apparatus comprising:

a memory;

a memory controller to identify the memory associated with a detected memory error; and

a hardware interface processor comprising a poller to obtain temperatures of the memory device, a queue to store the measured temperatures, and an error handler to write, in the memory device when a memory error is detected, a highest measured temperature stored in the queue.

11. An apparatus as defined in claim 10 , wherein the memory device comprises a dual in-line memory module (DIMM), and the error handler is to log the highest measured temperature in a serial presence detect (SPD) byte of the DIMM.

12. An apparatus as defined in claim 10 , wherein the error handler is to write a plurality of temperatures from the queue that precede the memory error in an event log.

13. An apparatus as defined in claim 10 , wherein the error handler is to write the highest measured temperature and an identifier corresponding to the memory device in an event log.