Semiconductor module including a switch and non-central diode
A semiconductor module having one or more silicon carbide diode elements mounted on a switching element is provided in which the temperature rise is reduced by properly disposing each of the diode elements on the switching element, to thereby provide a thermal dissipation path for the respective diode elements. The respective diode elements are arranged on a non-central portion of the switching element, to facilitate dissipation of the heat produced by each of the diode elements, whereby the temperature rise in the semiconductor module is reduced.
1. A semiconductor module, comprising:
a switching element including a top surface and a bottom surface opposing the top surface; and
a silicon carbide diode element provided on a non-central portion of the top surface of the switching element, a bottom surface of the silicon carbide diode element facing the top surface of the switching element,
wherein the switching element is rectangular-shaped and the silicon carbide diode element is provided directly on the top surface of the switching element in close proximity to a corner of the switching element, and
the bottom surface of the switching element faces a top surface of an insulating substrate, and the top surface of the switching element is electrically connected to a metal film in contact with the top surface of the insulating substrate,
wherein the top surface of the switching element is electrically connected with the bottom surface of the silicon carbide diode element.
2. The semiconductor module of claim 1 , wherein an input output portion, through which electric current flows into or from the switching element and the silicon carbide diode element, is made of a lead strip.
3. The semiconductor module of claim 1 , wherein the switching element is any one of a silicon IGBT element, a silicon carbide IGBT element, a silicon MOSFET element and a silicon carbide MOSFET element.
4. The semiconductor module of claim 1 , wherein an emitter on the top surface of the switching element is electrically connected to the metal film in contact with the top surface of the insulating substrate.
5. A semiconductor module, comprising:
a switching element including a top surface and a bottom surface opposing the top surface; and
a silicon carbide diode element provided on a non-central portion of the top surface of the switching element, a bottom surface of the silicon carbide diode element facing the top surface of the switching element,
wherein the switching element is rectangular-shaped and the silicon carbide diode element is provided directly on the top surface of the switching element in closer proximity to one corner of the rectangular-shaped switching element than the other three corners of the rectangular-shaped switching element, and
the bottom surface of the switching element faces a top surface of an insulating substrate, and the top surface of the switching element is electrically connected to a film in contact with the top surface of the insulating substrate,
wherein the top surface of the switching element is electrically connected with the bottom surface of the silicon carbide diode element.
6. The semiconductor module of claim 5 , wherein an input output portion, through which electric current flows into or from the switching element and the silicon carbide diode element, is made of a lead strip.
7. The semiconductor module of claim 5 , wherein the switching element is any one of a silicon IGBT element, a silicon carbide IGBT element, a silicon MOSFET element and a silicon carbide MOSFET element.
8. The semiconductor module of claim 5 , wherein an emitter on the top surface of the switching element is electrically connected to the film in contact with the top surface of the insulating substrate.