Light emitting diode systems including optical display systems having a microdisplay
Light emitting diode systems are disclosed.
1. A system comprising:
a light emitting device including:
a multi-layer stack of materials including a light generating region, and a first layer supported by the light generating region, a surface of the first layer being configured so that light generated by the light generating region can emerge from the light emitting device via a surface of the first layer, a shape of a surface of the multi-layer stack being rectangular and the surface of the first layer having a dielectric function that varies spatially according to a pattern; and
at least one electrical contact pad disposed along an edge of the surface of the first layer; and
a package having a first surface and a second surface opposite the first surface, the package including:
a plurality of plated regions for providing electrical contact to the light emitting device; and
a plurality of wire bonds connected between the plated regions and the at least one electrical contact pad.
2. The system of claim 1 , wherein the plurality of wire bonds includes at least about 5 wire bonds.
3. The system of claim 1 , wherein the plurality of wire bonds includes at least about 10 wire bonds.
4. The system of claim 1 , wherein the plurality of wire bonds includes at least about 25 wire bonds.
5. The system of claim 1 , wherein the plurality of wire bonds includes at least about 50 wire bonds.
6. The system of claim 1 , wherein an aspect ratio of the surface of the multi-layer stack is about 4×3.
7. The system of claim 1 , wherein the aspect ratio of the surface of the multi-layer stack is about 16×9.
8. The system of claim 1 , wherein the package further comprises a light emitting panel.
9. The system of claim 1 , wherein the package is mounted on a heat sink device.
10. The system of claim 1 , wherein the package is mounted on a core board.
11. The device of claim 1 , wherein the light emitting device is a light emitting diode.
12. The device of claim 1 , wherein the light emitting device is a surface emitting laser.
13. The system of claim 11 , wherein an aspect ratio of the surface of the first layer is about 4×3.
14. The system of claim 11 , wherein an aspect ratio of the surface of the first layer is about 16×9.
15. The device of claim 1 , wherein the package further comprises a plurality of castellations to provide electrical contact from the first surface of the package to the second surface of the package.
16. The device of claim 11 , wherein the light emitting diode is a photonic lattice light emitting diode.
17. The system of claim 16 , wherein an aspect ratio of the surface of the first layer is about 4×3.
18. The system of claim 16 , wherein an aspect ratio of the surface of the first layer is about 16×9.