Gallium nitride light emitting devices on diamond
Wide bandgap devices are formed on a diamond substrate, such as for light emitting diodes as a replacement for incandescent light bulbs and fluorescent light bulbs. In one embodiment, diodes (or other devices) are formed on diamond in at least two methods. A first method comprises growing a wide bandgap material on diamond and building devices on that grown layer. The second method involves bonding a wide bandgap layer (device or film) onto diamond and building the device onto the bonded layer. These devices may provide significantly higher efficiency than incandescent or fluorescent lights, and provide significantly higher light or energy density than other technologies. Similar methods and structures result in other wide bandgap semiconductor devices.
1. A method comprising:
implanting ions in a diamond substrate to provide a top compliant layer to form a top compliant surface on the diamond substrate; and
bonding a layer of wide bandgap material on the top compliant surface of the ion implanted diamond substrate such that the compliant layer reduces a lattice mismatch between the substrate and the layer of bonded wide bandgap material.
2. The method of claim 1 wherein the wide bandgap material comprises cubic boron nitride.
3. The method of claim 1 wherein the wide bandgap material comprises GaN.
4. The method of claim 2 wherein bonding the layer of cubic boron nitride to the top compliant surfaces is done using optical bonding.
5. The method of claim 1 wherein the implanted ions comprise hydrogen ions.
6. The method of claim 1 wherein the implanted ions comprise boron ions.
7. The method of claim 1 and further comprising forming a device in the layer of wide bandgap material.
8. The method of claim 1 wherein the diamond substrate comprises polycrystalline diamond.
9. The method of claim 1 wherein the diamond substrate comprises single crystalline chemical vapor deposition formed diamond.
10. A method comprising:
forming a top compliant layer in an ion implanted diamond substrate to form a top compliant surface on the diamond substrate; and
bonding a layer of cubic boron nitride on the top compliant surface of the ion implanted diamond substrate such that the compliant layer reduces a lattice mismatch between the substrate and the layer of bonded cubic boron nitride material.
11. The method of claim 10 wherein bonding the layer of cubic boron nitride to the top compliant surfaces is done using optical bonding.
12. The method of claim 10 wherein the wide bandgap material is cubic boron nitride, and further comprising forming a device in the layer of cubic boron nitride.
13. The method of claim 10 and further comprising conductively doping at least a portion of the diamond substrate.
14. The method of claim 13 wherein the wide bandgap material is cubic boron nitride, and further comprising using layer of cubic boron nitride with the doped diamond substrate to form a device.
15. A method comprising:
implanting hydrogen ions in a diamond substrate to provide a top compliant layer to form a top compliant surface on the diamond substrate; and
bonding a layer of cubic boron nitride on the top compliant surface of the hydrogen implanted diamond substrate such that the compliant layer reduces a lattice mismatch between the substrate and the layer of cubic boron nitride.
16. The method of claim 15 wherein bonding the layer of cubic boron nitride to the top compliant surfaces is done using optical bonding.
17. The method of claim 15 wherein the concentration of hydrogen ions is between approximately 8×10 16 to 10 17 atoms per cubic centimeter.
18. The method of claim 15 wherein the hydrogen ions are implanted with an energy ranging from 50 KeV to 1 MeV.
19. The method of claim 15 wherein the diamond is a monocrystalline diamond.
20. The method of claim 19 wherein the diamond compliant layer has a 111 crystalline orientation.
21. A method comprising:
implanting H 2 in a diamond substrate to provide a top compliant layer;
bonding a layer of p or n doped cubic boron nitride on the H 2 implanted diamond substrate;
growing a layer of diamond on the layer of p or n doped cubic boron nitride;
implanting H 2 in the grown diamond layer; and
growing a layer of n or p doped cubic boron nitride on the H 2 implanted grown diamond layer.