Laser machining systems and methods with moving laser scanning stage(s) providing force cancellation

1. A laser machining system comprising:

a part handling system including a workpiece support surface for supporting a workpiece to be machined;

at least one laser source;

at least first and second laser scanning stages positioned relative to the part handling system for linear movement along substantially parallel scanning axes;

at least first and second optical heads located on the first and second laser scanning stages, respectively, the first and second optical heads including respective first and second beam delivery systems for receiving respective first and second laser beams, modifying the laser beams, and directing the modified laser beams to a workpiece supported on the workpiece support surface while the scanning stages are moving; and

a motion system for controlling movement of the scanning stages along the scanning axes with substantially equal and opposite motion.

2. The laser machining system of claim 1 wherein the part handling system, the scanning stages and the optical heads are arranged such that the optical heads are located below the workpiece support surface.

3. The laser machining system of claim 1 wherein the part handling system, the scanning stages and the optical heads are arranged such that the optical heads are located above the workpiece support surface.

4. The laser machining system of claim 1 further comprising a center of gravity moving device pivotable about an axis substantially perpendicular to the scanning axes.

5. The laser machining system of claim 1 wherein each of the beam delivery systems is configured to modify the respective first and second laser beams by splitting the laser beams into multiple beamlets.

6. The laser machining system of claim 5 wherein each of the beam delivery systems is configured to shape and image the beamlets onto a workpiece.

7. The laser machining system of claim 1 wherein the motion system comprises:

first and second linear motors coupled to the first and second laser scanning stages, respectively, for providing linear motion;

first and second position feedback systems for providing position feedback for the respective first and second laser scanning stages; and

a motion controller for controlling linear motion of each of the laser scanning stages in response to the position feedback.

8. The laser machining system of claim 1 wherein the laser source includes first and second lasers for generating the first and second laser beams.

9. The laser machining system of claim 1 wherein the laser source includes a single laser for generating a single laser beam, and further comprising a beam delivery system for splitting the single laser beam to generate the first and second laser beams.

10. The laser machining system of claim 1 further comprising a base and an isolation mechanism coupled to the base, wherein the base supports at least the part handling system, the laser scanning stages, and the optical heads.

11. A laser machining system comprising:

a part handling system including a workpiece support surface for supporting a workpiece to be machined;

at least one laser source for generating at least one laser beam;

at least one laser scanning stage positioned relative to the part handling system for linear movement along a scanning axis;

at least one optical head located on the laser scanning stage, the optical head including a beam delivery system for receiving the beam, modifying the beam, and directing the modified beam to a workpiece supported on the workpiece support surface while the at least one laser scanning stage is moving;

at least first and second symmetric mass followers positioned for linear movement along follower axes substantially parallel to the scanning axis; and

a motion system for controlling movement of the scanning stage along the scanning axis and for controlling movement of the mass followers substantially equal and opposite to the motion of the scanning stage.

12. The laser machining system of claim 11 wherein each of the mass followers has a moving mass that is substantially one-half a moving mass of the optical head and scanning stage.

13. The laser machining system of claim 11 wherein the part handling system, the scanning stages and the optical heads are arranged such that the optical heads are located below the workpiece support surface.

14. The laser machining system of claim 11 further comprising a base and an isolation mechanism coupled to the base, wherein the base supports at least the part handling system, the laser scanning stage, and the optical head.

15. A method of laser machining a workpiece, the method comprising:

generating at least one laser beam;

directing the at least one laser beam into at least a first optical head on at least a first laser scanning stage;

modifying the laser beam within the first optical head such that at least one modified beam is directed out of the optical head and at the workpiece;

moving at least the first laser scanning stage along at least a first scanning axis resulting in a first moving mass, wherein the at least one modified beam directed out of the first optical head at the workpiece scribes the workpiece as the first laser scanning stage moves; and

moving a second moving mass along at least one axis substantially parallel to the first scanning axis, the second moving mass being substantially equivalent to the first moving mass, and wherein the first and second moving masses move with substantially equal and opposite motion.

16. The method of claim 15 further comprising:

directing the laser beam into a second optical head on a second laser scanning stage;

modifying the laser beam within the second optical head such that at least one modified beam is directed out of the second optical head and at the workpiece; and

wherein moving the second moving mass includes moving the second laser scanning stage along a second scanning axis substantially parallel to the first scanning axis, wherein the at least one modified beam directed out of the second optical head at the workpiece scribes the workpiece as the second laser scanning stage moves.

17. The method of claim 15 wherein moving the second moving mass includes moving first and second mass followers along first and second follower axes substantially parallel to the first scanning axis.

18. The method of claim 15 wherein modifying the beam includes splitting the beam into multiple beamlets.

19. The method of claim 15 wherein modifying the beam includes passing the beam through a mask to shape the beam and imaging the shaped beam on the workpiece.

20. The method of claim 15 wherein directing the laser beam into the optical head includes directing the laser beam into a side region of at least one optical head, wherein modifying the laser beam includes modifying the beam within the optical head such that at least one modified beam is directed out of a top region of the optical head, and wherein the optical head is moved beneath the workpiece such that the at least one modified beam scans the workpiece and ablates a portion of the workpiece to form a scribe line in the workpiece.

21. A dual laser scanning stage system comprising:

at least first and second laser scanning stages positioned relative to a part handling system for linear movement along substantially parallel scanning axes;

at least first and second optical heads located on the first and second laser scanning stages, respectively, the first and second optical heads including respective first and second beam delivery systems for receiving respective first and second laser beams, modifying the laser beams, and directing the modified laser beams to a workpiece supported on the workpiece support surface while the scanning stages are moving; and

a motion system for controlling movement of the scanning stages along the scanning axes with substantially equal and opposite motion.