IP Library Granted Patent US 8,451,083
Granted Patent B2
US 8,451,083 · App. 13/149,114 · Granted May 28, 2013

Coil component and method of manufacturing the same

Inventors: Takeshi Okumura (Tokyo, JP); Tomokazu Ito (Tokyo, JP)
Assignee: TDK Corporation
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Quick Facts
Patent No.
US 8,451,083
App. No.
13/149,114
Granted
May 28, 2013
Kind
B2
Abstract

A coil component is provided with a magnetic substrate made of magnetic ceramic material, a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate, a plurality of bump electrodes formed on the principal surface of the thin-film coil layer, and an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes. Each bump electrode has an exposure surface on a bottom surface and on two side surfaces of a layered product composed of the magnetic substrate, the thin-film coil layer and the insulating resin layer. A corner of the each bump electrode has a notch portion. The insulating resin layer includes a center resin portion provided in a center of the principal surface of the thin-film coil layer and a plurality of corner resin portions provided in the notch portion of each bump electrode.

Claims (33)

1. A coil component comprising:

a magnetic substrate made of magnetic ceramic material;

a thin-film coil layer containing a coil conductor formed on one principal surface of the magnetic substrate;

a plurality of bump electrodes formed on a principal surface of the thin-film coil layer;

an insulating resin layer formed on the principal surface of the thin-film coil layer excluding formation positions of the bump electrodes, wherein:

the magnetic substrate, the thin-film coil layer and the insulating resin layer form a layered product,

each of the bump electrodes has an exposure surface on a bottom surface and on two side surfaces of the layered product,

the thin-film coil layer contains a plurality of terminal electrodes of the coil conductor,

each of the plurality of terminal electrodes is connected to a corresponding one of the bump electrodes and has an exposure surface on at least one of the two side surfaces of the layered product,

a corner of each of the bump electrodes has a notch portion; wherein

the insulating resin layer includes:

a center resin portion provided at a center of the principal surface of the thin-film coil layer; and

a plurality of corner resin portions, and

each of the plurality of corner resin portions is provided at the notch portion of each of the bump electrodes at a corner of the principal surface of the thin-film coil layer, and is separated by the each of the bump electrode from the center resin portion.

2. The coil component as claimed in claim 1 , wherein each terminal electrode has the exposure surface on both of the two side surfaces of the layered product.

3. The coil component as claimed in claim 1 , wherein each terminal electrode includes a first electrode portion directly connected to the coil conductor without being connected via the corresponding one of the bump electrodes and a second electrode portion connected to the coil conductor via the corresponding one of the bump electrodes,

the first electrode portion has the exposure surface on one of the two side surfaces, and

the second electrode portion has the exposure surface on the other of the two side surfaces.

4. The coil component as claimed in claim 1 , wherein:

the thin-film coil layer includes:

a multilayered insulating member containing first and second insulating layers;

a first spiral conductor formed on a surface of the first insulating layer; and

a second spiral conductor formed on a surface of the second insulating layer,

the coil conductor constitutes a common mode filter including the first and second spiral conductors that mutually couple magnetically, and

each of the plurality of terminal electrodes is embedded in the multilayered insulating member.

5. The coil component as claimed in claim 3 , wherein:

a width of the first electrode portion in a first direction perpendicular to a longitudinal direction of the first electrode portion is smaller than that of the bump electrode in a same direction, and

a width of the second electrode portion in a second direction perpendicular to a longitudinal direction of the second electrode portion is smaller than that of the bump electrode in a same direction.

6. The coil component as claimed in claim 1 , wherein a thickness of each of the bump electrodes is larger than that of the coil conductor.

7. The coil component as claimed in claim 1 , wherein the bump electrodes are formed by plating.

8. The coil component as claimed in claim 1 , wherein the exposure surface on the bottom surface of each of the bump electrodes is flush with a principal surface of the insulating resin layer.

9. The coil component as claimed in claim 1 , wherein the insulating resin layer has a notch portion at a corner of the insulating resin layer.

10. The coil component as claimed in claim 1 , wherein the insulating resin layer includes a magnetic material.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2011
From: OKUMURA, TAKESHI; ITO, TOMOKAZU
To: TDK CORPORATION
Reel/Frame 026766/0867 →
Priority Claims (3)
JP 2010-124262 · May 31, 2010 · national
JP 2011-120949 · May 30, 2011 · national
JP 2011-120950 · May 30, 2011 · national
Continuity (1)
Related Publication 20110291790A1 · Dec 1, 2011