Method for encapsulating an electronic arrangement

1. Method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on butylene block copolymers and comprising blocks formed from styrene is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated, said pressure-sensitive adhesive having a WVTR of less than 40 g/m 2 ·d, and/or has an OTR of less than 5000 g/m 2 ·d.bar.

2. Method according to claim 1 , wherein the pressure-sensitive adhesive is provided in the form of an adhesive tape.

3. Method according to claim 1 , wherein the pressure-sensitive adhesive and/or the regions of the electronic arrangement that are to be encapsulated are heated before, during and/or after the application of the pressure-sensitive adhesive.

4. Method according to claim 1 , wherein the pressure-sensitive adhesive is crosslinked following application on the electronic arrangement.

5. Method according to claim 1 , wherein the application of the pressure-sensitive adhesive takes place without subsequent curing.

6. Method according to claim 1 , wherein the butylene block copolymers comprise polymer blocks formed by polymerization of isobutylene or isobutylene in combination with n-butene and/or 1,3-dienes.

7. Method according to claim 6 , wherein the block copolymers have a polystyrene fraction of 10% to 35% by weight.

8. Method according to claim 6 , wherein the pressure-sensitive adhesive has a block copolymer fraction of at least 20% by weight, and/or

the pressure-sensitive adhesive has a block copolymer fraction of not more than 90% by weight.

9. Method according to claim 6 , wherein the fraction of the isobutylene block copolymers as a proportion of the total fraction of the block copolymers is at least 40% by weight.

10. Method according to claim 6 , wherein the pressure-sensitive adhesive comprises hydrogenated resins having a degree of hydrogenation of at least 90%.

11. Method according to claim 6 , wherein the pressure-sensitive adhesive comprises at least one resin which has a DACP value of more than 30° C. and an MMAP value of more than 50° C., and/or the pressure sensitive adhesive comprises at least one resin which has a softening temperature of more than 95° C.

12. Method according to claim 6 , wherein the pressure-sensitive adhesive comprises one or more additives selected from the group consisting of plasticizers, primary antioxidants, secondary antioxidants, in-process stabilizers, light stabilizers, processing assistants, endblock reinforcer resins, and elastomeric polymers.

13. Method according to claim 6 , wherein the pressure-sensitive adhesive comprises one or more nanoscale fillers, transparent fillers and/or getter and/or scavenger fillers.

14. Method according to claim 6 , wherein the pressure-sensitive adhesive has an average transmittance of at least 75%, in the wavelength range from 400 nm to 800 nm.

15. Method according to claim 6 , wherein the pressure-sensitive adhesive is of UV-blocking design in the wavelength range from 320 nm to 400 nm, having an average transmittance of not more than 20%.

16. Method according to claim 6 , wherein the pressure-sensitive adhesive is in the form of a carrier-free adhesive tape.

17. The method of claim 1 , wherein said butylene block copolymers are isobutylene block copolymers.

18. Electronic arrangement having an organic electronic structure, and a pressure-sensitive adhesive, the electronic structure being at least partly encapsulated by the pressure-sensitive adhesive, wherein the pressure-sensitive adhesive comprises polymer blocks formed by polymerization of isobutylene or isobutylene in combination with n-butene and/or 1,3-dienes,and blocks formed from styrene, said pressure-sensitive adhesive having a WVTR of less than 40 g/m 2 ·d, and/or has an OTR of less than 5000 g/m 2 ·d·bar.