Semiconductor apparatus and endoscope apparatus
An image pickup apparatus according to an embodiment includes: an image pickup device chip including an image pickup device formed on a first principal surface thereof and an external terminal for the image pickup device formed on a second principal surface thereof; a wiring board including a distal end portion including a connection pad, a flexure portion flexed at an angle of no less than 90 degrees, and an extending portion, the wiring board including a wiring layer extending from the distal end portion to the extending portion via the flexure portion, the wiring board being kept within a space immediately above the second principal surface of the image pickup device chip; a bonding layer that joins the second principal surface of the image pickup device chip and the distal end portion of the wiring board; and a bonding wire that electrically connects the external terminal and the connection pad.
1. A semiconductor apparatus comprising:
a semiconductor chip including a semiconductor device formed on a first principal surface thereof and an external terminal for the semiconductor device, the external terminal being formed on a second principal surface thereof;
a wiring board including a distal end portion including a connection pad, a flexure portion flexed at an angle of no less than 90 degrees, and an extending portion, the wiring board including a wiring layer extending from the distal end portion to the extending portion via the flexure portion, the wiring board being kept within a space immediately above the second principal surface of the semiconductor chip;
a bonding layer that joins the second principal surface of the semiconductor chip and the distal end portion of the wiring board; and
a bonding wire that electrically connects the external terminal and the connection pad.
2. The semiconductor apparatus according to claim 1 ,
wherein the wiring board is a multilayer wiring board at least including a wiring layer on each of two surfaces thereof, and the distal end portion, the flexure portion and a portion on the flexure portion side of the extending portion are separated in a width direction by longitudinal slits; and
wherein a plurality of the separated flexure portions are flexed alternately in opposite directions.
3. The semiconductor apparatus according to claim 2 , wherein the plurality of flexure portions are flexed at a right angle alternately in opposite directions.
4. The semiconductor apparatus according to claim 1 , wherein the distal end portion is bonded to a center portion of the second principal surface of the semiconductor chip.
5. The semiconductor apparatus according to claim 4 , further comprising a seal portion that covers the bonding wire and the flexure portion.
6. The semiconductor apparatus according to claim 1 ,
wherein the semiconductor device includes an image pickup device; and
wherein a transparent substrate is joined to the first principal surface.
7. An endoscope apparatus comprising:
an image pickup device chip disposed in a distal end portion of an insertion portion thereof, the image pickup device chip including an image pickup device formed on a first principal surface thereof and an external terminal for the image pickup device, the external terminal being formed on a second principal surface thereof;
a wiring board including a distal end portion including a connection pad, a flexure portion flexed at an angle of no less than 90 degrees, and an extending portion, the wiring board including a wiring layer extending from the distal end portion to the extending portion via the flexure portion, the wiring board being kept within a space immediately above the second principal surface of the image pickup device chip;
a bonding layer that joins the second principal surface of the image pickup device chip and the distal end portion of the wiring board;
a bonding wire that electrically connects the external terminal and the connection pad; and
a transparent substrate joined to the first principal surface.
8. The endoscope apparatus according to claim 7 ,
wherein the wiring board is a multilayer wiring board at least including a wiring layer on each of two surfaces thereof, and the distal end portion, the flexure portion and a portion on the flexure portion side of the extending portion are separated in a width direction by longitudinal slits; and
wherein a plurality of the separated flexure portions are flexed alternately in opposite directions.
9. The endoscope apparatus according to claim 8 , wherein the plurality of flexure portions are flexed at a right angle alternately in opposite directions.
10. The endoscope apparatus according to claim 7 , wherein the distal end portion is bonded to a center portion of the second principal surface of the image pickup device chip.
11. The endoscope apparatus according to claim 10 , further comprising a seal portion that covers the bonding wire and the flexure portion.