Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

1. A tamper and/or theft resistant Blister Pack device for housing a product item, comprising:

a metallic foil cover;

a tray attached to the metallic foil cover;

an opening line formed on the metallic foil cover to make the metallic foil cover part of an antenna structure; and

an integrated circuit chip electrically coupled to the metallic foil cover at two sides of the opening line,

wherein said product item is housed between the metallic foil cover and the tray.

2. A device as in claim 1 wherein the integrated circuit chip is coupled to the metallic foil through a strap assembly, the strap assembly comprising a second substrate having interconnections connected to the integrated circuit and to the metallic foil.

3. A device for housing a product item, comprising:

a conductive cover;

a housing structure attached to the conductive cover, wherein said product item is housed between the conductive cover and the housing structure;

an opening line formed on the conductive cover to make the conductive cover part of an antenna structure; and

an integrated circuit chip electrically coupled to the conductive cover at two sides of the opening line.

4. A device as in claim 3 wherein the opening line is disposed in the conductive cover and not interfered with the sealing of the product item housing.

5. A device as in claim 3 wherein the integrated circuit chip is a Radio Frequency Identification (RFID) chip.

6. A device as in claim 3 wherein the integrated circuit chip is coupled to a second substrate wherein the second substrate is adhered to the conductive cover in a manner to allow the integrated circuit chip to electrically connect to the conductive cover.

7. A device as in claim 3 wherein the housing structure is a tray comprising a plurality of features configured to house the product item and the opening line is disposed in the conductive cover and not interfered with the sealing of the product item housing.

8. A device as in claim 3 wherein the housing structure is a bottle and the conductive cover is placed over the opening of the bottle to seal the bottle.

9. A device for housing a product item, comprising:

a first substrate comprising a conductive layer wherein the conductive layer comprises one or more opening lines formed thereon;

a housing structure attached to the first substrate, wherein said product item is housed between the housing structure and the conductive layer except for the opening lines;

an integrated circuit chip electrically coupled to the conductive layer at two sides of one of the one or more opening lines, wherein the conductive layer with the one of the one or more opening lines forms part of an antenna structure for the integrated circuit chip.

10. A device as in claim 9 wherein the integrated circuit chip is a Radio Frequency Identification (RFID) chip.

11. A device as in claim 9 wherein the integrated circuit chip is coupled to a second substrate wherein the second substrate is adhered to the conductive layer in a manner to allow the integrated circuit chip to electrically connect to the conductive layer.

12. A device as in claim 9 wherein the housing structure is a bottle and the conductive layer completely covers the opening of the bottle except for the opening lines.

13. A method comprising:

creating an opening line in a metallic foil cover, the opening line enabling the metallic foil cover to act as part of an antenna structure;

coupling an RFID integrated circuit chip to the metallic foil cover at two sides of the opening line; and

attaching a housing structure to the metallic foil cover, wherein a product item is housed between the housing structure and the metallic foil cover.

14. A method as in claim 13 wherein the housing structure is a tray attached to the metallic foil cover, the tray comprising a plurality of features configured to house the product item.

15. A method as in claim 13 wherein the housing structure is a bottle and the metallic foil cover is placed over the opening of the bottle to seal the bottle.

16. A method comprising:

forming a conductive layer on a substrate;

creating an opening line in an conductive layer, the opening line enabling the conductive layer to act as part of an antenna structure;

coupling an RFID integrated circuit chip to the conductive layer at two sides of the opening line;

attaching a housing structure to the substrate, wherein a product item is housed between the housing structure and the conductive layer except for the opening line.

17. A method as in claim 16 wherein the housing structure is a bottle and the conductive layer is placed over the opening of the bottle.

18. A method comprising:

forming a conductive layer on a substrate, wherein the conductive layer completely covers a portion of the first substrate;

creating an opening line in the conductive layer, the opening line enabling the conductive layer to act as part of an antenna structure;

coupling an RFID integrated circuit chip to the conductive layer at two sides of the opening line; and

attaching a housing structure to the conductive layer, wherein a product item is housed between the housing structure and the conductive layer, and the housing structure is one of a bottle or a tray, the tray comprising a plurality of features configured to house the product item.

19. A method as in claim 18 further comprising forming another opening line on the conductive layer.