IP Library Granted Patent US 8,476,179
Granted Patent B2
US 8,476,179 · App. 13/358,732 · Granted Jul 2, 2013

Grain boundary-insulated semiconductor ceramic, semiconductor ceramic capacitor, and method for producing semiconductor ceramic capacitor

Inventor: Tsutomu Tatekawa (Nagaokakyo, JP)
Assignee: Murata Manufacturing Co., Ltd.
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Quick Facts
Patent No.
US 8,476,179
App. No.
13/358,732
Granted
Jul 2, 2013
Kind
B2
Abstract

A grain boundary-insulated semiconductor ceramic contains a SrTiO 3 -based compound as a main component, and a diffusing agent containing a grain boundary insulating agent and a glass component. The grain boundary insulating agent is composed of a material free of lead, the glass component mainly contains a SiO 2 —X 2 O-MO—TiO 2 -based glass material that does not contain boron or lead and in which X represents an alkali metal, and M represents at least one of barium, strontium, and calcium, and the content of the glass component is 3 to 15 parts by weight relative to 100 parts by weight of the grain boundary insulating agent. A component base is composed of the grain boundary-insulated semiconductor ceramic.

Claims (35)

1. A grain boundary-insulated semiconductor ceramic comprising:

a strontium titanate as a main component; and

a diffusing agent containing a grain boundary insulating agent and a glass component,

wherein the grain boundary insulating agent comprises a material free of lead,

the glass component mainly comprises a SiO 2 —X 2 O-MO—TiO 2 — based glass material that does not contain boron or lead, and in which X represents an alkali metal, and M represents at least one element selected from barium, strontium, and calcium, and

the content of the glass component is 3 to 15 parts by weight relative to 100 parts by weight of the grain boundary insulating agent.

2. The grain boundary-insulated semiconductor ceramic according to claim 1 , wherein the grain boundary insulating agent contains at least one of bismuth and copper.

3. The grain boundary-insulated semiconductor ceramic according to claim 2 , wherein the content of the grain boundary insulating agent is 0.8 to 1.5 parts by weight relative to 100 parts by weight of the main component.

4. The grain boundary-insulated semiconductor ceramic according to claim 3 , wherein the alkali metal X in the glass component is lithium.

5. The grain boundary-insulated semiconductor ceramic according to claim 1 , wherein the content of the grain boundary insulating agent is 0.8 to 1.5 parts by weight relative to 100 parts by weight of the main component.

6. The grain boundary-insulated semiconductor ceramic according to claim 5 , wherein the alkali metal X in the glass component is lithium.

7. The grain boundary-insulated semiconductor ceramic according to claim 1 , wherein the alkali metal X in the glass component is lithium.

8. The grain boundary-insulated semiconductor ceramic according to claim 1 , wherein the grain boundary insulating agent contains bismuth and copper.

9. The grain boundary-insulated semiconductor ceramic according to claim 1 , wherein the strontium titanate contains at least one of Ba, Ca and a rare earth element.

10. The grain boundary-insulated semiconductor ceramic according to claim 9 , wherein the rare earth element is Y.

11. A semiconductor ceramic capacitor comprising a component base comprising the grain boundary-insulated semiconductor ceramic according to claim 1 .

12. The semiconductor ceramic capacitor according to claim 11 ,

wherein the component base has a tubular shape, and

has an electrode on each of an inner peripheral surface and an outer peripheral surface of the component base.

13. A semiconductor ceramic capacitor comprising a component base comprising the grain boundary-insulated semiconductor ceramic according to claim 4 .

14. The semiconductor ceramic capacitor according to claim 13 ,

wherein the component base has a tubular shape, and

has an electrode on each of an inner peripheral surface and an outer peripheral surface of the component base.

15. A semiconductor ceramic capacitor comprising a component base comprising the grain boundary-insulated semiconductor ceramic according to claim 8 .

16. The semiconductor ceramic capacitor according to claim 15 ,

wherein the component base has a tubular shape, and

has an electrode on each of an inner peripheral surface and an outer peripheral surface of the component base.

17. A method for producing a semiconductor ceramic capacitor, comprising the steps of:

providing a reducing atmosphere sintered body which comprising strontium and titanium;

providing a grain boundary insulating agent comprising a material free of lead and a glass component comprising a SiO 2 —X 2 O-MO—TiO 2 -based glass material that does not contain boron or lead and in which X represents an alkali metal, and M represents at least one element selected from barium, strontium, and calcium; and

preparing a component base by performing a heat treatment in an air atmosphere while mixing and stirring the sintered body with the grain boundary insulating agent and the glass component.

18. The method according to claim 17 ,

wherein the sintered body has a tubular shape, and

the method further comprises forming an electrode on each of an inner peripheral surface and an outer peripheral surface of the component base by a plating process.

19. The method according to claim 17 wherein the amount of the glass component is 3 to 15 parts by weight relative to 100 parts by weight of the grain boundary insulating agent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2012
From: TATEKAWA, TSUTOMO
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 027599/0774 →
Priority Claims (1)
JP 2011-038259 · Feb 24, 2011 · national
Continuity (1)
Related Publication 20120217615A1 · Aug 30, 2012