IP Library Granted Patent US 8,479,899
Granted Patent B2
US 8,479,899 · App. 12/081,330 · Granted Jul 9, 2013

Damper, and electronic component and electronic apparatus equipped with the damper

Inventors: Masataka Ohtake (Tokyo, JP); Masayuki Itakura (Tokyo, JP)
Assignee: Polymatech Co., Ltd.
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Quick Facts
Patent No.
US 8,479,899
App. No.
12/081,330
Granted
Jul 9, 2013
Kind
B2
Abstract

Disclosed is a damper that is easy to mount and capable of attenuating to a sufficient degree a vibration generated by an electronic component; also disclosed are an electronic component and an electronic apparatus that are provided with such a damper. A mounting insertion portion is provided with a hard portion maintaining the configuration of the mounting insertion portion.

Claims (33)

1. A damper comprising:

a vibration attenuating portion formed of an elastic material; and

a mounting insertion portion protruding from the vibration attenuating portion, with the mounting insertion portion for insertion into a mounting hole formed in an electronic component generating a vibration within an electronic apparatus, to thereby elastically support the electronic component,

wherein the vibration attenuating portion has a first surface and a second surface opposite to the first surface, the mounting insertion portion attaches to a center of the first surface, the second surface has a recess in a center of the second surface, and

wherein the mounting insertion portion comprises

a hard portion forming a central portion in a columnar configuration which maintains a configuration of the mounting insertion portion, the hard portion exhibiting an E-hardness of 70 or more, and

a soft portion surrounding annularly the central portion, the soft portion being continuous with the vibration attenuating portion and exhibiting an E-hardness of 50 or less so that the soft portion is compressible when inserted into the mounting hole.

2. A damper according to claim 1 , wherein the soft portion forms an external side surface of the mounting insertion portion.

3. A damper according to claim 1 , wherein the mounting insertion portion has a fitting protrusion provided on a side surface.

4. A damper according to claim 3 , wherein the fitting protrusion is formed as a ridge-like swelling continuous in an inserting direction thereof.

5. A damper according to claim 3 , wherein the fitting protrusion is formed as a semi-spherical swelling.

6. A damper according to claim 1 , wherein the hard portion is partially exposed outside on a side surface of the mounting insertion portion.

7. A damper according to claim 1 , wherein the hard portion partially forms a side surface of the mounting insertion portion.

8. A damper according to claim 1 , wherein the hard portion has higher rigidity than that of the vibration attenuating portion.

9. A damper according to claim 1 , wherein the hard portion has a lock portion to be engaged with an engagement portion provided in the electronic component.

10. A damper according to claim 1 , wherein the vibration attenuating portion has, on a surface on an opposite side of a surface having the mounting insertion portion, a contact portion to be brought into contact with an interior of the electronic apparatus.

11. A damper according to claim 10 , wherein the contact portion is formed of a hard resin.

12. A damper according to claim 1 , wherein the vibration attenuating portion has a protruding portion to be brought into contact with an interior of the electronic apparatus.

13. A damper according to claim 1 , wherein the hard portion exhibits conductivity and has a connecting portion to be brought into contact with the electronic component, and wherein the vibration attenuating portion has a conductive protruding portion to be brought into contact with an interior of the electronic apparatus and a conductive buffer portion electrically connecting the hard portion and the protruding portion to each other and buffering a vibration transmitted from the hard portion.

14. An electronic component generating a vibration inside an electronic apparatus, comprising a vibration attenuating portion of the damper according to claim 1 provided on an external surface with a mounting insertion portion of the damper being inserted into a mounting hole formed in the external surface.

15. An electronic apparatus comprising an electronic component generating a vibration inside a casing, wherein a mounting insertion portion of the damper according to claim 1 is inserted into a mounting hole provided in an external surface, to thereby attach the damper, and wherein the electronic component elastically supported by a vibration attenuating portion of the damper is provided inside the casing.

16. A damper according to claim 1 , wherein the mounting insertion portion is solid.

17. A damper according to claim 1 , wherein the vibration attenuating portion is a disc-like configuration.

18. A damper according to claim 17 , wherein the soft portion extends from the vibration attenuating portion.

19. A damper according to claim 1 , wherein the vibration attenuating portion is inserted between the electronic component and the electronic apparatus.

20. A damper according to claim 1 , the hard portion tapers towards the vibration attenuating portion.

21. A damper comprising:

a vibration attenuating portion without a through hole formed of an elastic material; and

a mounting insertion portion protruding from the vibration attenuating portion, with the mounting insertion portion for insertion into a mounting hole formed in an electronic component generating a vibration within an electronic apparatus, to thereby elastically support the electronic component,

wherein the vibration attenuating portion has a first surface and a second surface opposite to the first surface, the mounting insertion portion attaches to a center of the first surface, the second surface has a recess in a center of the second surface, and

wherein the mounting insertion portion comprises

a hard portion forming a central portion in a columnar configuration which maintains a configuration of the mounting insertion portion, and

a soft portion surrounding annularly the central portion, the soft portion being continuous with the vibration attenuating portion.

Assignments (3)
CHANGE OF NAME Recorded Jun 1, 2018
From: POLYMATECH JAPAN CO., LTD.
To: SEKISUI POLYMATECH CO., LTD.
Reel/Frame 045964/0914 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2015
From: POLYMATECH CO., LTD.
To: POLYMATECH JAPAN CO., LTD.
Reel/Frame 035301/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2008
From: OHTAKE, MASATAKA; ITAKURA, MASAYUKI
To: POLYMATECH CO., LTD.
Reel/Frame 020836/0485 →
Priority Claims (1)
JP 2007-107573 · Apr 16, 2007 · national
Continuity (1)
Related Publication 20080302622A1 · Dec 11, 2008