Engineered oxygen profile in metal gate electrode and nitrided high-K gate dielectrics structure for high performance PMOS devices
A PMOS transistor is disclosed which includes a nitrogen containing barrier to oxygen diffusion between a gate dielectric layer and a metal gate in the PMOS transistor, in combination with a low oxygen region of the metal gate in direct contact with the nitrogen containing barrier and an oxygen rich region of the metal gate above the low oxygen content metal region. The nitrogen containing barrier may be formed by depositing nitrogen containing barrier material on the gate dielectric layer or by nitridating a top region of the gate dielectric layer. The oxygen rich region of the metal gate may be formed by depositing oxidized metal on the low oxygen region of the metal gate or by oxidizing a top region of the low oxygen region of the metal gate.
1. An integrated circuit, comprising:
a PMOS transistor, further including:
a PMOS nitrogen containing barrier layer formed on a top surface of a PMOS gate dielectric layer;
a PMOS low oxygen metal layer with a work function greater than 5 electron volts and an oxygen concentration less than 2 percent, formed on a top surface of said PMOS nitrogen containing barrier layer;
a PMOS oxygen rich metal layer with a work function greater than 5 electron volts and an oxygen concentration greater then 10 percent, formed on a top surface of said PMOS low oxygen metal layer; and
a PMOS top metal layer with a work function greater than 5 electron volts, formed on a top surface of said PMOS oxygen rich metal layer; and
an n-channel metal oxide semiconductor (NMOS) transistor, further including a metal gate layer with a work function less than 5 electron volts and an oxygen concentration less than 2 percent, formed on a top surface of an NMOS gate dielectric layer.
2. The integrated circuit of claim 1 , in which said PMOS nitrogen containing barrier layer is between 0.3 and 0.5 nanometers thick.
3. The integrated circuit of claim 1 , in which said PMOS low oxygen metal layer is between 0.5 and 2 nanometers thick.
4. The integrated circuit of claim 1 , in which PMOS oxygen rich metal layer is between 0.5 and 2 nanometers thick.
5. The integrated circuit of claim 1 , in which said PMOS nitrogen containing barrier layer is a deposited layer with a different chemical composition than said PMOS gate dielectric layer.
6. The integrated circuit of claim 1 , in which said PMOS nitrogen containing barrier layer is a top region of said PMOS gate dielectric layer to which nitrogen has been added.
7. The integrated circuit of claim 1 , in which said PMOS oxygen rich metal layer is a deposited oxidized metal layer.
8. The integrated circuit of claim 1 , in which said PMOS oxygen rich metal layer is a top region of said PMOS low oxygen metal layer to which oxygen has been added.
9. The integrated circuit of claim 1 , in which said PMOS oxygen rich metal layer has an oxygen concentration greater than 20 percent.