IP Library Granted Patent US 8,486,490
Granted Patent B2
US 8,486,490 · App. 12/461,311 · Granted Jul 16, 2013

Method for producing a three-dimensionally shaped object

Inventors: Isao Fuwa (Osaka, JP); Norio Yoshida (Kitakatsuragi, JP); Satoshi Abe (Moriguchi, JP)
Assignee: Panasonic Corporation
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Quick Facts
Patent No.
US 8,486,490
App. No.
12/461,311
Granted
Jul 16, 2013
Kind
B2
Abstract

In a method for producing a three-dimensionally shaped object, a powder layer is formed by feeding a powdery material to a substrate and a solidified layer is formed by irradiating a light beam on a specified portion of the powder layer to sinter or melt the specified portion of the powder layer. A three-dimensionally shaped object having a plurality of solidified layers laminated one above another is obtained by repeating the powder layer formation and the solidified layer formation. In the method, a stress is preliminarily applied to the substrate to reduce the amount of deformation of the substrate after production of the shaped object prior to the powder layer forming step.

Claims (11)

1. A method of producing a three-dimensionally shaped object having a plurality of solidified layers laminated one above another, comprising:

applying a stress to a substrate by forming the substrate into a bent shape having a downwardly bent peripheral portion and then fixing the substrate to a rigid table so that the top surface of the substrate becomes substantially planar;

forming a powder layer by feeding a powdery material to the top surface of the substrate;

forming a solidified layer by irradiating a light beam on a specified portion of the powder layer to sinter or melt the specified portion of the powder layer; and

repeating the powder layer forming step and the solidified layer forming step to produce a three-dimensionally shaped object having a plurality of solidified layers laminated one above another;

wherein a bending moment caused by a thermal stress generated in the substrate during the layers formation is offset by the bending moment caused by the stress applied to the substrate from forming the substrate into the bent shape, thereby a substantially planar surface is achieved between the substrate and the solidified layers.

2. The method of claim 1 , wherein the substrate is formed into a bent shape by a machining work.

3. The method of claim 1 , wherein the substrate is formed into a bent shape by heating the bottom surface of the substrate with a heating unit.

4. The method of claim 3 , wherein the heating unit is configured to irradiate a light beam.

5. The method of claim 4 , wherein the heating unit irradiates the light beam on the bottom surface of the substrate along substantially the same irradiation route as a light beam irradiation route to be used in the solidified layer forming step.

6. The method of claim 1 , wherein the substrate is formed into a bent shape by performing shot blast on the top surface of the substrate.

Assignments (2)
MERGER Recorded Feb 13, 2012
From: PANASONIC ELECTRIC WORKS CO.,LTD.,
To: PANASONIC CORPORATION
Reel/Frame 027697/0525 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2009
From: FUWA, ISAO; YOSHIDA, NORIO; ABE, SATOSHI
To: PANASONIC ELECTRIC WORKS CO., LTD.
Reel/Frame 023086/0215 →
Priority Claims (1)
JP 2008-206141 · Aug 8, 2008 · national
Continuity (1)
Related Publication 20100034983A1 · Feb 11, 2010