Assembly of multi-chip modules using sacrificial features
A multi-chip module (MCM) is described. This MCM includes two substrates, having facing surfaces, which are mechanically coupled. Disposed on a surface of a first of these substrates, there is a negative feature, which is recessed below this surface. A positive feature in the MCM, which includes an assembly material other than a bulk material in the substrates, at least in part mates with the negative feature. For example, the positive feature may be disposed on the surface of the other substrate. Alternatively, prior to assembly of the MCM, the positive feature may be a separate component from the substrates (such as a micro-sphere). Note that the assembly material has a bulk modulus that is less than a bulk modulus of the material in the substrates. Furthermore, at least a portion of the positive feature may have been sacrificed when the mechanical coupling was established.
1. A multi-chip module (MCM), comprising:
a first substrate having a first surface; and
a second substrate having a second surface, wherein the first surface is mechanically coupled to the second surface, thereby aligning the first substrate and the second substrate;
wherein the mechanical coupling is facilitated by a negative feature recessed below at least one of the first surface and the second surface, which has an opening, defined by an edge, in at least one of the first surface and the second surface;
wherein the mechanical coupling is facilitated by a positive feature in the MCM that includes a first material other than a bulk material in the first substrate and the second substrate, which at least in part mates with the negative feature, wherein the first material comprises one or more of a metal, a metal alloy, a polymer, or a compliant polymer; and
wherein the positive feature includes a spherically shaped coupling component, wherein the spherically shaped coupling component has a core that includes a second material, and an outer shell that includes the first material, wherein the second material comprises a less compressible or compliant material than the first material.
2. The MCM of claim 1 , wherein the first material was, at least in part, sacrificed when the mechanical coupling was established.
3. The MCM of claim 1 , wherein the first material was, at least in part, mechanically compressed when the mechanical coupling was established.
4. The MCM of claim 1 , wherein the first material was, at least in part, melted when the mechanical coupling was established.
5. The MCM of claim 1 , wherein the negative feature is defined in the first surface and the positive feature is defined on the second surface.
6. The MCM of claim 1 , wherein, prior to assembly of the MCM, the positive feature was a separate component from the first substrate and the second substrate.
7. The MCM of claim 1 , wherein the first surface includes a first negative feature and the second surface includes a second negative feature; and
wherein the positive feature mates with the first negative feature and the second negative feature, thereby facilitating the alignment.
8. The MCM of claim 1 , wherein the positive feature includes a protrusion from at least one of the first surface and the second surface;
wherein the protrusion includes a second material, and has sides and an upper surface which is substantially parallel to the first surface and the second surface; and
wherein the protrusion includes a layer, deposited on the upper surface, the sides or both, which includes the first material.
9. The MCM of claim 8 , wherein the first material was, at least in part, sacrificed when the mechanical coupling was established.
10. The MCM of claim 8 , wherein the first material was, at least in part, mechanically compressed when the mechanical coupling was established.
11. The MCM of claim 8 , wherein the first material was, at least in part, melted when the mechanical coupling was established.
12. The MCM of claim 1 , wherein the negative feature, the positive feature, or both are defined in a dielectric layer deposited on at least one of the first substrate and the second substrate.
13. The MCM of claim 1 , wherein the alignment facilitates electrical coupling of components on the first substrate and the second substrate using a through-silicon via.
14. The MCM of claim 13 , wherein the bulk modulus of the first material is less than a bulk modulus of a metal connector in the through-silicon via.
15. An electronic device, comprising at least one MCM, wherein the MCM includes:
a first substrate having a first surface; and
a second substrate having a second surface, wherein the first surface is mechanically coupled to the second surface, thereby aligning the first substrate and the second substrate;
wherein the mechanical coupling is facilitated by a negative feature recessed below at least one of the first surface and the second surface, which has an opening, defined by an edge, in at least one of the first surface and the second surface;
wherein the mechanical coupling is facilitated by a positive feature in the MCM that includes a first material other than a bulk material in the first substrate and the second substrate, which at least in part mates with the negative feature, wherein the first material comprises one or more of a metal, a metal alloy, a polymer, or a compliant polymer; and
wherein the positive feature includes a spherically shaped coupling component, wherein the spherically shaped coupling component has a core that includes a second material, and an outer shell that includes the first material, wherein the second material comprises a less compressible or compliant material than the first material.
16. The MCM of claim 1 , wherein the second material comprises one of sapphire or ruby.
17. The MCM of claim 1 , wherein the second material comprises one of a glass, a ceramic material, a plastic, or a metal.