IP Library Granted Patent US 8,490,480
Granted Patent B2
US 8,490,480 · App. 13/286,927 · Granted Jul 23, 2013

Device for monitoring tire pressure

Inventors: Sisay Tadele (Leonberg, DE); Andreas Nagora (Walzbachtal, DE)
Assignee: BorgWarner BERU Systems GmbH
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Quick Facts
Patent No.
US 8,490,480
App. No.
13/286,927
Granted
Jul 23, 2013
Kind
B2
Abstract

A device for monitoring tire pressure includes an antenna for transmitting pressure data, a printed circuit board with a circuit for measuring and transmitting pressure data that is connected to the antenna, a power source for supplying the circuit, and a housing surrounding the printed circuit board, According to the invention, the housing is produced by insert-molding the antenna.

Claims (14)

1. A device for monitoring tire pressure, comprising:

an antenna for transmitting pressure data;

a printed circuit board, connected to the antenna, having a circuit for measuring and transmitting pressure data;

a power source for supplying the circuit; and

a housing surrounding the printed circuit board, said housing is produced by insert-molding the antenna.

2. The device according to claim 1 , wherein the antenna comprises press-fit pins that protrude from a housing wall and are pressed into metallized holes of the printed circuit board, so that the antenna is connected by means of a pressing technique to the circuit carried by the printed circuit board.

3. A device according to claim 1 , wherein the antenna is a magnetic antenna.

4. The device according to claim 3 , wherein the magnetic antenna is formed by a metal bracket embedded in a housing wall.

5. A device according to claim 1 , wherein the power source and the printed circuit board are disposed on top of one another in the housing.

6. A device according to claim 1 , wherein a spacer plate is disposed between the power source and the printed circuit board.

7. A device according to claim 1 , wherein the power source is disposed on the side of the printed circuit board which faces away from the antenna.

8. A device according to claim 1 , wherein the housing comprises undercut detent elements, which grip the power source.

9. A device according to claim 1 , wherein the printed circuit board is embedded into a potting compound.

10. A device according to claim 1 wherein the printed circuit board is embedded into a potting compound.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2019
From: HUF HÜLSBECK & FÜRST GMBH & CO. KG
To: HUF BAOLONG ELECTRONICS BRETTEN GMBH
Reel/Frame 049810/0209 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2014
From: BORGWARNER BERU SYSTEMS GMBH
To: HUF HULSBECK & FURST GMBH & CO. KG
Reel/Frame 031870/0728 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2011
From: TADELE, SISAY; NAGORA, ANDREAS
To: BORGWARNER BERU SYSTEMS GMBH
Reel/Frame 027454/0853 →
Priority Claims (1)
DE 10 2010 050 365 · Nov 3, 2010 · national
Continuity (1)
Related Publication 20120111102A1 · May 10, 2012