Vertically stackable dies having chip identifier structures
A vertically stackable die having a chip identifier structure is disclosed. In a particular embodiment, a semiconductor device is disclosed that includes a die comprising a first through via to communicate a chip identifier and other data. The semiconductor device also includes a chip identifier structure that comprises at least two through vias that are each hard wired to an external electrical contact.
1. A semiconductor device comprising:
a die comprising:
a first set of at least one through via to communicate a chip select signal and other data; and
a second set of at least two through vias forming a portion of a chip identifier structure, wherein each via, of the second set of through vias is hard wired to an external electrical contact, and wherein each of the second set of through vias is coupled to a pad configured to be coupled to an adjacent through via in another die to form the chip identifier structure.
2. The semiconductor device of claim 1 , further comprising chip identification decoding logic on the die, the chip identification decoding logic coupled to the chip identifier structure.
3. The semiconductor device of claim 1 , further comprising an interface to a host device.
4. The semiconductor device of claim 3 , wherein the host device is a separate device or a mother die.
5. The semiconductor device of claim 1 , wherein the external electrical contact is coupled to a voltage source or to ground.
6. The semiconductor device of claim 5 , wherein the voltage source or the ground is received from a package substrate or a mother die.
7. The semiconductor device of claim 2 , further comprising chip identifier selection logic comprising the chip identification decoding logic and responsive to the chip select signal.
8. The semiconductor device of claim 7 , wherein the chip identifier selection logic detects a voltage source or ground at the second set of through vias in the chip identifier structure, wherein at least one through via of the second set of through vias transmits a different signal than other through vias of the second set of through vias.
9. The semiconductor device of claim 1 , further comprising at least one of: a set top box, a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, or a computer, into which the semiconductor device is integrated.
10. A semiconductor device comprising:
a stack of at least two dies, wherein each die comprises:
a portion of a chip identifier structure that comprises a first set of at least two through vias that are each hard wired to a first set of external electrical contacts, wherein each of the first set of through vias has a pad configured to be coupled to an adjacent through via in another die in the chip identifier structure; and
a second set of through vias forming a portion of a chip communication structure, wherein each via of the second set of through vias is hard wired to one external electrical contact of a second set of external electrical contacts.
11. The semiconductor device of claim 10 , wherein each external electrical contact in the first set of external electrical contacts is coupled to ground or to a voltage source.
12. The semiconductor device of claim 10 , further comprising at least one of: a set top box, a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, or a computer, into which the semiconductor device is integrated.
13. The semiconductor device of claim 10 , wherein at least two dies of the stack of at least two dies comprise structurally identical circuitry.
14. A semiconductor device comprising:
a stack of at least two dies, wherein each comprises:
a portion of a means for identifying a die, the portion of the means for identifying the die comprising a first set of through vias, wherein each via of the first set of through vias is hard wired to a first set of means for making external electrical contact, and wherein each via of the first set of through vias is coupled to a pad configured to be coupled to an adjacent through via in another die to form the means for identifying a die; and
means for communicating a signal, the means for communicating a signal comprising a second set of through vias that are each hard wired to a second set of means for making external electrical contact.
15. The semiconductor device of claim 14 , wherein each means for making external electrical contact in the first set of means for making external electrical contact is coupled to ground or to a voltage source.
16. The semiconductor device of claim 14 , further comprising at least one of: a set top box, a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, or a computer, into which the semiconductor device is integrated.
17. The semiconductor device of claim 14 , wherein at least two dies of the stack of at least two dies comprise structurally identical circuitry.
18. A semiconductor device comprising:
a stack of at least two memory dies, wherein each memory die comprises:
a portion of a chip identifier structure that comprises a first set of at least two through vias that are each connected to a first set of external electrical contacts, wherein each of the first set of through vias has a pad configured to be coupled to an adjacent through via in another die in the chip identifier structure, wherein each external electrical contact of the first set of external electrical contacts is configured to transmit a chip select signal from a host device; and
a second set of through vias forming a portion of a chip communication structure, wherein each via of the second set of through vias is connected to one external electrical contact of a second set of external electrical contacts.