IP Library Granted Patent US 8,513,865
Granted Patent B2
US 8,513,865 · App. 13/190,145 · Granted Aug 20, 2013

LED lighting assembly

Inventor: Jong-Soo Ha (Shenzhen, CN)
Assignees: AAC Acoustic Technologies (Shenzhen) Co., Ltd.; American Audio Components Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,513,865
App. No.
13/190,145
Granted
Aug 20, 2013
Kind
B2
Abstract

A LED lighting assembly includes a substrate defining a body and a central hole surrounded by the body, a conductive mass positioned in the central hole of the substrate, a LED chip defining a bottom attached to the conductive mass, and a shell mounted on the body and forming a room together with the body.

Claims (16)

1. A LED lighting assembly, comprising:

a substrate defining a body and a central hole surrounded by the body, the body defining an upper surface and a lower surface opposite to the upper surface;

a thermal conductive mass positioned in the central hole of the substrate and defining an upper surface close to the upper surface of the body of the substrate and a lower surface opposite to the upper surface;

a LED chip defining a bottom attached to the upper surface of the thermal conductive mass;

a shell mounted on the upper surface of the body of the substrate and forming a room together with the body;

a phosphor coating covering an outer surface but not including the bottom of the LED chip;

a barrier surrounding and connected to a whole peripheral side of the phosphor coating for limiting the position of the phosphor coating;

a first electrode electrically connected to the conductive mass and a second electrode;

a first terminal electrically connected to the conductive mass and a second terminal electrically connected to the second electrode; wherein

the outline of the phosphor coating is square, the barrier is a square frame;

a pad is provided on the upper surface of the body to connect the second electrode to the second terminal, and the pad is disposed within the barrier and touches an inner wall of the barrier.

2. The LED lighting assembly as described in claim 1 , wherein an area of the upper surface of the conductive mass is not smaller than an area of the bottom of the LED chip, and the whole area of the bottom of the LED chip is completely attached to the upper surface of the conductive mass.

3. The LED lighting assembly as described in claim 1 , wherein the room is filled with inert gas.

4. The LED lighting assembly as described in claim 1 , wherein the first and second terminals are attached to the lower surface of the body of the substrate.

5. The LED lighting assembly as described in claim 4 , wherein the lower surface of the conductive mass is directly attached to the first terminal.

6. The LED lighting assembly as described in claim 5 , wherein an area of the first terminal is not smaller than an area of the lower surface of the conductive mass.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2017
From: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.
To: AAC TECHNOLOGIES PTE. LTD.
Reel/Frame 042319/0113 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2013
From: HA, JONGSOO
To: AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.; AMERICAN AUDIO COMPONENTS INC.
Reel/Frame 030792/0520 →
Priority Claims (1)
CN 2010 1 0538704 · Nov 10, 2010 · national
Continuity (1)
Related Publication 20120112617A1 · May 10, 2012